Inventor
KANG JE BONG
KR3 patents
Patents
3 patentsUS6031281AFeb 29, 2000
Semiconductor integrated circuit device having dummy bonding wires
SAMSUNG ELECTRONICS CO LTD52 citations85
US5923092AJul 13, 1999
Wiring between semiconductor integrated circuit chip electrode pads and a surrounding lead frame
SAMSUNG ELECTRONICS CO LTD18 citations79
US6407446B2Jun 18, 2002
Leadframe and semiconductor chip package having cutout portions and increased lead count
SAMSUNG ELECTRONICS CO LTD5 citations61