Inventor
VASUDEV PRAHALAD K
US25 patents
⚠️ This page may combine multiple inventors who share the name “VASUDEV PRAHALAD K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HUGHES AIRCRAFT CO
11 patentsUS4748485AMay 31, 1988
Opposed dual-gate hybrid structure for three-dimensional integrated circuits
HUGHES AIRCRAFT CO153 citations99
US4617066AOct 14, 1986
Process of making semiconductors having shallow, hyperabrupt doped regions by implantation and two step annealing
HUGHES AIRCRAFT CO184 citations99
US4659392AApr 21, 1987
Selective area double epitaxial process for fabricating silicon-on-insulator structures for use with MOS devices and integrated circuits
HUGHES AIRCRAFT CO96 citations96
US4509990AApr 9, 1985
Solid phase epitaxy and regrowth process with controlled defect density profiling for heteroepitaxial semiconductor on insulator composite substrates
HUGHES AIRCRAFT CO96 citations96
US5289027AFeb 22, 1994
Ultrathin submicron MOSFET with intrinsic channel
HUGHES AIRCRAFT CO28 citations92
US5027177AJun 25, 1991
Floating base lateral bipolar phototransistor with field effect gate voltage control
HUGHES AIRCRAFT CO32 citations92
US4816893AMar 28, 1989
Low leakage CMOS/insulator substrate devices and method of forming the same
HUGHES AIRCRAFT CO46 citations92
US4753895AJun 28, 1988
Method of forming low leakage CMOS device on insulating substrate
HUGHES AIRCRAFT CO34 citations92
US4439910AApr 3, 1984
Process for fabrication of monolithic transistor coupled electroluminescent diode
HUGHES AIRCRAFT CO31 citations92
US4388633AJun 14, 1983
Monolithic transistor coupled electroluminescent diode
HUGHES AIRCRAFT CO39 citations92
US4826300AMay 2, 1989
Silicon-on-sapphire liquid crystal light valve and method
HUGHES AIRCRAFT CO40 citations91
SEMATECH INC
9 patentsUS5474865ADec 12, 1995
Globally planarized binary optical mask using buried absorbers
SEMATECH INC163 citations99
US6100184AAug 8, 2000
Method of making a dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer
SEMATECH INC236 citations98
US6037664AMar 14, 2000
Dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer
SEMATECH INC306 citations98
US5674787AOct 7, 1997
Selective electroless copper deposited interconnect plugs for ULSI applications
SEMATECH INC838 citations98
US5480747AJan 2, 1996
Attenuated phase shifting mask with buried absorbers
SEMATECH INC75 citations96
US5660706AAug 26, 1997
Electric field initiated electroless metal deposition
SEMATECH INC33 citations93
US5472811ADec 5, 1995
Phase shifting mask structure with multilayer optical coating for improved transmission
SEMATECH INC39 citations90
US5418095AMay 23, 1995
Method of fabricating phase shifters with absorbing/attenuating sidewalls using an additive process
SEMATECH INC43 citations90
US5411824AMay 2, 1995
Phase shifting mask structure with absorbing/attenuating sidewalls for improved imaging
SEMATECH INC38 citations90
CORNELL RES FOUNDATION INC
4 patentsUS5830805ANov 3, 1998
Electroless deposition equipment or apparatus and method of performing electroless deposition
CORNELL RES FOUNDATION INC358 citations99
US5891513AApr 6, 1999
Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications
CORNELL RES FOUNDATION INC582 citations98
US5695810ADec 9, 1997
Use of cobalt tungsten phosphide as a barrier material for copper metallization
CORNELL RES FOUNDATION INC833 citations97
US5824599AOct 20, 1998
Protected encapsulation of catalytic layer for electroless copper interconnect
CORNELL RES FOUNDATION INC561 citations96