Inventor
HIRASAWA YUTAKA
JP33 patents
⚠️ This page may combine multiple inventors who share the name “HIRASAWA YUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUI MINING & SMELTING CO
16 patentsUS6270889B1Aug 7, 2001
Making and using an ultra-thin copper foil
MITSUI MINING & SMELTING CO64 citations95
US6605369B1Aug 12, 2003
Surface-treated copper foil and method for producing the same
MITSUI MINING & SMELTING CO19 citations92
US6319620B1Nov 20, 2001
Making and using an ultra-thin copper foil
MITSUI MINING & SMELTING CO22 citations92
US5545466AAug 13, 1996
Copper-clad laminate and printed wiring board
MITSUI MINING & SMELTING CO37 citations90
US5437914AAug 1, 1995
Copper-clad laminate and printed wiring board
MITSUI MINING & SMELTING CO46 citations90
US5858517AJan 12, 1999
Electrodeposited copper foil for printed wiring board and method of manufacturing the same
MITSUI MINING & SMELTING CO24 citations89
US6902824B2Jun 7, 2005
Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same
MITSUI MINING & SMELTING CO9 citations74
US6548153B2Apr 15, 2003
Composite material used in making printed wiring boards
MITSUI MINING & SMELTING CO10 citations74
US5833819ANov 10, 1998
Copper foil for a printed circuit board, a process and an apparatus for producing the same
MITSUI MINING & SMELTING CO11 citations73
US6610418B1Aug 26, 2003
Electolytic copper foil with carrier foil and method for manufacturing the same
MITSUI MINING & SMELTING CO7 citations71
US6444112B1Sep 3, 2002
Manufacturing method of electrodeposited copper foil
MITSUI MINING & SMELTING CO9 citations68
US6827867B2Dec 7, 2004
Method for manufacturing printed wiring board
MITSUI MINING & SMELTING CO4 citations63
US6716572B2Apr 6, 2004
Manufacturing process for printed wiring board
MITSUI MINING & SMELTING CO5 citations63
US6479170B2Nov 12, 2002
Electrodeposited copper foil, method of inspecting physical properties thereof, and copper-clad laminate employing the electrodeposited copper foil
MITSUI MINING & SMELTING CO5 citations62
US5997710ADec 7, 1999
Copper foil for a printed circuit board, a process and an apparatus for producing the same
MITSUI MINING & SMELTING CO4 citations62
US6616827B2Sep 9, 2003
Filtration method of copper electrolyte
MITSUI MINING & SMELTING CO5 citations57
MORIYAMA SANGYO KK
7 patentsUSD550379SSep 4, 2007
LED lamp
MORIYAMA SANGYO KK76 citations97
USD550869SSep 11, 2007
LED lamp
MORIYAMA SANGYO KK27 citations92
USD546985SJul 17, 2007
LED lamp
MORIYAMA SANGYO KK19 citations92
USD508234SAug 9, 2005
LED holder
MORIYAMA SANGYO KK8 citations73
USD505663SMay 31, 2005
LED holder
MORIYAMA SANGYO KK9 citations73
USD520657SMay 9, 2006
LED lamp
MORIYAMA SANGYO KK3 citations62
USD505662SMay 31, 2005
LED holder
MORIYAMA SANGYO KK5 citations62
TOSHIBA KK
5 patentsUS4992931AFeb 12, 1991
Data alignment correction apparatus for properly formatting data structures for different computer architectures
TOSHIBA KK61 citations96
US5341363AAug 23, 1994
Computer system capable of disconnecting itself from a lan
TOSHIBA KK26 citations92
US4887075ADec 12, 1989
Local area network system with a multi-computer system coupled thereto and method for controlling the same
TOSHIBA KK28 citations92
US5504866AApr 2, 1996
Lan control system
TOSHIBA KK9 citations74
US5029075AJul 2, 1991
Routing method in a computer communication network system
TOSHIBA KK13 citations74