Inventor

HO SHENG-HSIUNG

TW2 patents

Patents

2 patents

US7038327B2May 2, 2006

Anisotropic conductive film bonding pad

AU OPTRONICS CORP9 citations65

US7686909B2Mar 30, 2010

Reel-type package of flexible printed circuit boards and method for supplying thereof

AU OPTRONICS CORP2 citations59