Inventor
CHOI WOO BEOM
KR2 patents
Patents
2 patentsUS6197139B1Mar 6, 2001
Method for electrostatic thermal bonding of a pair of glass substrates by utilizing a silicon thin film
KOREA INST SCI & TECH31 citations90
US6007397ADec 28, 1999
Vacuum packaging apparatus for a field emission display and a method thereof using a glass-to-glass bonding
KOREA INST SCI & TECH18 citations81