Inventor
TIAGARAJ SATHYA NARASIMMAN
US5 patents
Patents
5 patentsUS12406962B2Sep 2, 2025
Power delivery through capacitor-dies in a multi-layered microelectronic assembly
INTEL CORP2 citations70
US12315794B2May 27, 2025
Skip level vias in metallization layers for integrated circuit devices
INTEL CORP0 citations61
US12288746B2Apr 29, 2025
Skip level vias in metallization layers for integrated circuit devices
INTEL CORP0 citations61
US12581968B2Mar 17, 2026
Package architecture of large dies using quasi-monolithic chip layers
INTEL CORP0 citations60
US12164319B2Dec 10, 2024
Dual loop voltage regulator
INTEL CORP0 citations60