Inventor

GORUGANTHU RAMA R

US61 patents

⚠️ This page may combine multiple inventors who share the name “GORUGANTHU RAMA R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GORUGANTHU RAMA R

ADVANCED MICRO DEVICES INC

Single point high resolution time resolved photoemission microscopy system and method

Quadrant avalanche photodiode time-resolved detection

Arrangement and method for providing an imaging path using a silicon-crystal damaging laser

Method and apparatus for stress testing a semiconductor device using laser-induced circuit excitation

Selectively activatable solar cells for integrated circuit analysis

Integrated circuit defect detection via laser heat and IR thermography

Substrate removal as a function of SIMS analysis

Thermally conductive integrated circuit mounting structures

Nanotube tip for atomic force microscope

Localized heating for defect isolation during die operation

Endpoint detection for thinning of silicon of a flip chip bonded integrated circuit

Picosecond imaging circuit analysis probe and system

Semiconductor die analysis as a function of optical reflections from the die

Defect detection in semiconductor devices

Time-resolved emission microscopy system

Acoustic 3D analysis of circuit structures

Circuit analysis and manufacture using electric field-induced effects

Repair of resistive electrical connections in an integrated circuit

Circuit construction in back side of die and over a buried insulator

Selective state change analysis of a SOI die

Substrate removal as a function of resistance at the back side of a semiconductor device

Probe points for heat dissipation during testing of flip chip IC

Substrate removal using thermal analysis

Thermally conductive integrated circuit mounting structures

Endpoint detection for thinning of silicon of a flip chip bonded integrated circuit

Electro-optical analysis of integrated circuits

Substrate removal from a semiconductor chip structure having buried insulator (BIN)

Electrical probing of SOI circuits

Dual-differential interferometry for silicon device damage detection

Substrate removal as a function of emitted photons at the back side of a semiconductor chip

IC analysis involving logic state mapping in a SOI die

Method of substrate silicon removal for integrated circuit devices

Timing margin alteration via the insulator of a SOI die

Magnetic resonance imaging of semiconductor devices

Probe grid for integrated circuit analysis

Defect detection via acoustic analysis

Forming elongated probe points useful in testing semiconductor devices

Probe grid for integrated circuit excitation

Substrate removal as a functional of sonic analysis

Ion implantation and laser anneal to create n-doped structures in silicon

LED alignment points for semiconductor die

Led in substrate with back side monitoring

MICROELECTRONICS & COMPUTER

Bonding metal members with multiple laser beams

Process for making semiconductor electrode bumps by metal cluster ion deposition and etching

Method of making semiconductor bonding bumps using metal cluster ion deposition

Ionized metal cluster beam systems and methods

Bonding metal electrical members with a frequency doubled pulsed laser beam

Segmented charge limiting test algorithm for electrical components

GORUGANTHU RAMA R

Laser scanning module including an optical isolator

(unassigned)

Substrate removal as a function of acoustic analysis