Inventor

BIRDSLEY JEFFREY D

US40 patents

⚠️ This page may combine multiple inventors who share the name “BIRDSLEY JEFFREY D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BIRDSLEY JEFFREY D

ADVANCED MICRO DEVICES INC

Quadrant avalanche photodiode time-resolved detection

Method and apparatus for stress testing a semiconductor device using laser-induced circuit excitation

Selectively activatable solar cells for integrated circuit analysis

Integrated circuit defect detection via laser heat and IR thermography

Substrate removal as a function of SIMS analysis

Semiconductor die analysis via fiber optic communication

Nanomachining method for integrated circuits

Semiconductor die analysis as a function of optical reflections from the die

Defect detection in semiconductor devices

Test fixture for future integration

Acoustic 3D analysis of circuit structures

Test arrangement and method for thinned flip chip IC

Circuit construction in back side of die and over a buried insulator

Selective state change analysis of a SOI die

System and method for circuit rebuilding via backside access

Substrate removal as a function of resistance at the back side of a semiconductor device

Probe points for heat dissipation during testing of flip chip IC

Substrate removal using thermal analysis

SOI die analysis of circuitry logic states via coupling through the insulator

Circuit access and analysis for a SOI flip-chip die

Back side reactive ion etch

Substrate removal as a function of emitted photons at the back side of a semiconductor chip

Magnetic resonance imaging of semiconductor devices

Nanomachining of integrated circuits

Probe grid for integrated circuit analysis

Defect detection via acoustic analysis

Forming elongated probe points useful in testing semiconductor devices

Probe grid for integrated circuit excitation

Substrate removal as a functional of sonic analysis

Ion implantation and laser anneal to create n-doped structures in silicon

LED alignment points for semiconductor die

Led in substrate with back side monitoring

Optical analysis of integrated circuits

IC die analysis via back side lens

IC die analysis via back side circuit construction with heat dissipation

Atomic force microscopy and signal acquisition via buried insulator

Intergrated circuit integrity analysis as a function of magnetic field decay

Selective back side reactive ion etch

ADVANCE MICRO DEVICES INC

Semiconductor device navigation using laser scribing

(unassigned)

Substrate removal as a function of acoustic analysis