Inventor

BRUCE MICHAEL R

US71 patents

⚠️ This page may combine multiple inventors who share the name “BRUCE MICHAEL R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BRUCE MICHAEL R

ADVANCED MICRO DEVICES INC

Single point high resolution time resolved photoemission microscopy system and method

Quadrant avalanche photodiode time-resolved detection

Arrangement and method for providing an imaging path using a silicon-crystal damaging laser

Laser-excited detection of defective semiconductor device

Method and apparatus for stress testing a semiconductor device using laser-induced circuit excitation

Selectively activatable solar cells for integrated circuit analysis

Integrated circuit defect detection via laser heat and IR thermography

Substrate removal as a function of SIMS analysis

Semiconductor die analysis via fiber optic communication

Nanotube tip for atomic force microscope

Localized heating for defect isolation during die operation

Nanomachining method for integrated circuits

Method for laser scanning flip-chip integrated circuits

Method for laser scanning flip-chip integrated circuits

Picosecond imaging circuit analysis probe and system

Semiconductor die analysis as a function of optical reflections from the die

Three-dimensional tomography

Defect detection in semiconductor devices

Test fixture for future integration

Time-resolved emission microscopy system

Acoustic 3D analysis of circuit structures

Circuit analysis and manufacture using electric field-induced effects

Repair of resistive electrical connections in an integrated circuit

Circuit construction in back side of die and over a buried insulator

Selective state change analysis of a SOI die

Method for laser analysis from the back side an electronic circuit formed on the front side of a semiconductor

Substrate removal as a function of resistance at the back side of a semiconductor device

Probe points for heat dissipation during testing of flip chip IC

Substrate removal using thermal analysis

SOI die analysis of circuitry logic states via coupling through the insulator

Circuit access and analysis for a SOI flip-chip die

Electro-optical analysis of integrated circuits

Photon detection enhancement of superconducting hot-electron photodetectors

Data processing device test apparatus and method therefor

Resistivity analysis

Photon beacon

Electrical probing of SOI circuits

Dual-differential interferometry for silicon device damage detection

Substrate removal as a function of emitted photons at the back side of a semiconductor chip

IC analysis involving logic state mapping in a SOI die

Timing margin alteration via the insulator of a SOI die

Magnetic resonance imaging of semiconductor devices

Nanomachining of integrated circuits

Probe grid for integrated circuit analysis

Defect detection via acoustic analysis

Forming elongated probe points useful in testing semiconductor devices

Probe grid for integrated circuit excitation

Substrate removal as a functional of sonic analysis

Ion implantation and laser anneal to create n-doped structures in silicon

SANDIA CORP

Apparatus and method for analyzing functional failures in integrated circuits