Inventor

DAVIS BRENNAN V

US39 patents

⚠️ This page may combine multiple inventors who share the name “DAVIS BRENNAN V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DAVIS BRENNAN V

ADVANCED MICRO DEVICES INC

Real-time photoemission detection system

Quadrant avalanche photodiode time-resolved detection

Method and apparatus for stress testing a semiconductor device using laser-induced circuit excitation

Selectively activatable solar cells for integrated circuit analysis

Integrated circuit defect detection via laser heat and IR thermography

Substrate removal as a function of SIMS analysis

Semiconductor die analysis via fiber optic communication

Nanomachining method for integrated circuits

Defect detection in semiconductor devices

Test fixture for future integration

Acoustic 3D analysis of circuit structures

Circuit construction in back side of die and over a buried insulator

Arrangement and method for using electron channeling patterns to detect substrate damage

Selective state change analysis of a SOI die

Substrate removal as a function of resistance at the back side of a semiconductor device

Probe points for heat dissipation during testing of flip chip IC

Substrate removal using thermal analysis

SOI die analysis of circuitry logic states via coupling through the insulator

Circuit access and analysis for a SOI flip-chip die

Substrate removal as a function of emitted photons at the back side of a semiconductor chip

Magnetic resonance imaging of semiconductor devices

Nanomachining of integrated circuits

Probe grid for integrated circuit analysis

Defect detection via acoustic analysis

Forming elongated probe points useful in testing semiconductor devices

Probe grid for integrated circuit excitation

Substrate removal as a functional of sonic analysis

Ion implantation and laser anneal to create n-doped structures in silicon

LED alignment points for semiconductor die

Led in substrate with back side monitoring

Optical analysis of integrated circuits

Indirect stimulation of an integrated circuit die

IC die analysis via back side lens

IC die analysis via back side circuit construction with heat dissipation

Atomic force microscopy and signal acquisition via buried insulator

Fiber optic semiconductor analysis arrangement and method therefor

Semiconductor analysis arrangement and method therefor

Semiconductor analysis arrangement and method therefor

(unassigned)

Substrate removal as a function of acoustic analysis