Inventor
KIDO TAKANORI
JP17 patents
⚠️ This page may combine multiple inventors who share the name “KIDO TAKANORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHOWA DENKO KK
14 patentsUS5800577ASep 1, 1998
Polishing composition for chemical mechanical polishing
SHOWA DENKO KK94 citations97
US6299659B1Oct 9, 2001
Polishing material composition and polishing method for polishing LSI devices
SHOWA DENKO KK66 citations94
US5935278AAug 10, 1999
Abrasive composition for magnetic recording disc substrate
SHOWA DENKO KK21 citations92
US6547843B2Apr 15, 2003
LSI device polishing composition and method for producing LSI device
SHOWA DENKO KK21 citations91
US6478836B1Nov 12, 2002
Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry
SHOWA DENKO KK38 citations91
US6436835B1Aug 20, 2002
Composition for polishing a semiconductor device and process for manufacturing a semiconductor device using the same
SHOWA DENKO KK39 citations91
US6410444B1Jun 25, 2002
Composition for polishing a semiconductor device and process for manufacturing a semiconductor device using the same
SHOWA DENKO KK35 citations91
US6387139B1May 14, 2002
Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry
SHOWA DENKO KK22 citations91
US6733553B2May 11, 2004
Abrasive composition for polishing semiconductor device and method for producing semiconductor device using the same
SHOWA DENKO KK18 citations82
US9620374B2Apr 11, 2017
Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrate
SHOWA DENKO KK2 citations73
US6844263B2Jan 18, 2005
LSI device polishing composition and method for producing LSI device
SHOWA DENKO KK7 citations72
US11781244B2Oct 10, 2023
Seed crystal for single crystal 4H—SiC growth and method for processing the same
SHOWA DENKO KK1 citations58
US10453693B2Oct 22, 2019
Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrate
SHOWA DENKO KK0 citations52
US9960048B2May 1, 2018
Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrate
SHOWA DENKO KK0 citations52