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Inventor
DING ZHIPENG
SG
2 patents
⚠️ This page may combine multiple inventors who share the name “DING ZHIPENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WUHAN MEMSONICS TECH CO LTD
1 patent
US11799440B2
Oct 24, 2023
Packaging structure and method of acoustic device
WUHAN MEMSONICS TECH CO LTD
0 citations
38
AGENCY SCIENCE TECH & RES
1 patent
US10134607B2
Nov 20, 2018
Method for low temperature bonding of wafers
AGENCY SCIENCE TECH & RES
0 citations
32