Inventor
YOSHIMATSU NAOKI
JP36 patents
⚠️ This page may combine multiple inventors who share the name “YOSHIMATSU NAOKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
25 patentsUS6521983B1Feb 18, 2003
Semiconductor device for electric power
MITSUBISHI ELECTRIC CORP137 citations97
US5767573AJun 16, 1998
Semiconductor device
MITSUBISHI ELECTRIC CORP138 citations97
US6762937B2Jul 13, 2004
Power module
MITSUBISHI ELECTRIC CORP41 citations95
US7656016B2Feb 2, 2010
Power semiconductor device
MITSUBISHI ELECTRIC CORP38 citations92
US6940164B1Sep 6, 2005
Power module
MITSUBISHI ELECTRIC CORP20 citations92
US6522544B1Feb 18, 2003
Power module
MITSUBISHI ELECTRIC CORP31 citations92
US6509629B2Jan 21, 2003
Power module
MITSUBISHI ELECTRIC CORP46 citations92
US6787893B2Sep 7, 2004
Semiconductor device
MITSUBISHI ELECTRIC CORP19 citations91
US6563211B2May 13, 2003
Semiconductor device for controlling electricity
MITSUBISHI ELECTRIC CORP24 citations91
US10104775B2Oct 16, 2018
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP9 citations82
US5463251AOct 31, 1995
Power semiconductor package having improved durability
MITSUBISHI ELECTRIC CORP15 citations74
US11239123B2Feb 1, 2022
Semiconductor module, semiconductor device, and vehicle
MITSUBISHI ELECTRIC CORP2 citations73
US9437460B2Sep 6, 2016
Method for manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP5 citations69
US12334408B2Jun 17, 2025
Semiconductor device and method for manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP1 citations63
US12500135B2Dec 16, 2025
Semiconductor device comprising semiconductor element; insulating component; lead electrode; and first bonding material, second bonding material, third bonding material, and fourth bonding material made of a same material
MITSUBISHI ELECTRIC CORP0 citations62
US12243789B2Mar 4, 2025
Semiconductor device, semiconductor system, moving body, and method for manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP0 citations62
US11101225B2Aug 24, 2021
Semiconductor device and power conversion device
MITSUBISHI ELECTRIC CORP1 citations62
US9455215B2Sep 27, 2016
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP2 citations62
US11562977B2Jan 24, 2023
Semiconductor device comprising a resin case and a wiring member that is flat in the resin case
MITSUBISHI ELECTRIC CORP0 citations52
US12341078B2Jun 24, 2025
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations51
US10707141B2Jul 7, 2020
Semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP0 citations51
US9698091B2Jul 4, 2017
Power semiconductor device
MITSUBISHI ELECTRIC CORP1 citations51
US9691730B2Jun 27, 2017
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP0 citations51
US6580147B2Jun 17, 2003
Semiconductor device having built-in capacitors
MITSUBISHI ELECTRIC CORP0 citations51
US9735100B2Aug 15, 2017
Semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP0 citations47
YOSHIMATSU NAOKI
4 patentsUS8401073B2Mar 19, 2013
Inverse quantization circuit, inverse quantization method and image reproducing apparatus
YOSHIMATSU NAOKI6 citations71
US9307260B2Apr 5, 2016
Image decoding apparatus, image decoding method, image coding apparatus, and image coding method
YOSHIMATSU NAOKI1 citations51
US8422562B2Apr 16, 2013
Decoding circuit, decoding method, and image reproducing apparatus
YOSHIMATSU NAOKI2 citations47
US8249182B2Aug 21, 2012
Decoding circuit, decoding method, encoding circuit, and encoding method
YOSHIMATSU NAOKI0 citations40
TANAKA TAKESHI
2 patentsUS8982964B2Mar 17, 2015
Image decoding device, image coding device, methods thereof, programs thereof, integrated circuits thereof, and transcoding device
TANAKA TAKESHI4 citations72
US9185406B2Nov 10, 2015
Image decoding device, image coding device, methods thereof, programs thereof, integrated circuits thereof, and transcoding device
TANAKA TAKESHI3 citations61