Inventor

FLAIM TONY D

US49 patents

⚠️ This page may combine multiple inventors who share the name “FLAIM TONY D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FLAIM TONY D

BREWER SCIENCE INC

Thermosetting anti-reflective coatings compositions

Adhesion promoting product and process for treating an integrated circuit substrate therewith

Adhesion promoting product and process for treating an integrated circuit substrate

Thermosetting polyester anti-reflective coatings for multilayer photoresist processes

Thermosetting polyester anti-reflective coatings for multilayer photoresist processes

Method for making multilayer resist structures with thermosetting anti-reflective coatings

Positive working polyamic acid/imide photoresist compositions and their use as dielectrics

Thermosetting polyester anti-reflective coatings for multilayer photoresist processes

Non-subliming mid-UV dyes and ultra-thin organic arcs having differential solubility

Non-subliming Mid-UV dyes and ultra-thin organic arcs having differential solubility

Microlithographic substrate cleaning and compositions therefor

Spin-on protective coatings for wet-etch processing of microelectronic substrates

Hybrid organic-inorganic polymer coatings with high refractive indices

Non-aromatic chromophores for use in polymer anti-reflective coatings

Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings

Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings

Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates

Polyimides as laser release materials for 3-D IC applications

Photolithographic article utilizing polymers with light-absorbing properties for anti-reflective coating

Positive working polyamic acid/imide photoresist compositions and their use as dielectrics

Multiple bonding layers for thin-wafer handling

Anti-reflective coating compositions for use with low k dielectric materials

Laser ablative dielectric material

Spin-on protective coatings for wet-etch processing of microelectronic substrates

Poly(cyanocinnamate)s for structural and optical applications

Multiple bonding layers for thin-wafer handling

Alkaline-resistant negative photoresist for silicon wet-etch without silicon nitride

Polymer film stencil process for fan-out wafer-level packaging of semiconductor devices

HONG WENBIN

Cyclic olefin compositions for temporary wafer bonding

Cyclic olefin compositions for temporary wafer bonding

Cyclic olefin compositions for temporary wafer bonding

Development of high-viscosity bonding layer through in-situ polymer chain extension

FLAIM TONY D

Method for reversibly mounting a device wafer to a carrier substrate

Article including a device wafer reversibly mountable to a carrier substrate

SUN SAM X

On-track process for patterning hardmask by multiple dark field exposures

On-track process for patterning hardmask by multiple dark field exposures

LIN QIN

Reversal lithography approach by selective deposition of nanoparticles

Method of making radiation-sensitive sol-gel materials

XU GU

Spin-on protective coatings for wet-etch processing of microelectronic substrates

Spin-on protective coatings for wet-etch processing of microelectronic substrates

UNIV MISSOURI

Highly plasma etch-resistant photoresist composition containing a photosensitive polymeric titania precursor

BREWER SCIENCE

Soluble conducting polymers and their use in manufacturing electronic devices

MOSS MARY G

Positive working polyamic acid/imide and diazoquinone photoresist with high temperature pre-bake

PULIGADDA RAMA

Multiple bonding layers for thin-wafer handling

LUMIMOVE INC

Two-layer transparent electrostatic charge dissipating coating

TANG TINGJI

Acid-etch resistant, protective coatings

LI CHENGHONG

Spin-on protective coatings for wet-etch processing of microelectronic substrates

MCCUTCHEON JEREMY

Methods of transferring device wafers or layers between carrier substrates and other surfaces

YESS KIMBERLY A

Scratch-resistant coatings for protecting front-side circuitry during backside processing