Inventor
LAPKE MARTIN
DE7 patents
⚠️ This page may combine multiple inventors who share the name “LAPKE MARTIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP BV
6 patentsUS9847258B2Dec 19, 2017
Plasma dicing with blade saw patterned underside mask
NXP BV16 citations81
US9601437B2Mar 21, 2017
Plasma etching and stealth dicing laser process
NXP BV7 citations81
US8809166B2Aug 19, 2014
High die strength semiconductor wafer processing method and system
NXP BV9 citations81
US9812361B2Nov 7, 2017
Combination grinding after laser (GAL) and laser on-off function to increase die strength
NXP BV1 citations49
US9349645B2May 24, 2016
Apparatus, device and method for wafer dicing
NXP BV0 citations48
US10347534B2Jul 9, 2019
Variable stealth laser dicing process
NXP BV0 citations38