Inventor
SHIMIZU ICHIO
JP38 patents
⚠️ This page may combine multiple inventors who share the name “SHIMIZU ICHIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
19 patentsUS4920074AApr 24, 1990
Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof
HITACHI LTD316 citations98
US5488254AJan 30, 1996
Plastic-molded-type semiconductor device
HITACHI LTD66 citations96
US5041901AAug 20, 1991
Lead frame and semiconductor device using the same
HITACHI LTD82 citations96
US4725692AFeb 16, 1988
Electronic device and lead frame used thereon
HITACHI LTD89 citations96
US5808359ASep 15, 1998
Semiconductor device having a heat sink with bumpers for protecting outer leads
HITACHI LTD40 citations95
US4942452AJul 17, 1990
Lead frame and semiconductor device
HITACHI LTD72 citations95
US5194935AMar 16, 1993
Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structure
HITACHI LTD23 citations93
US5150193ASep 22, 1992
Resin-encapsulated semiconductor device having a particular mounting structure
HITACHI LTD107 citations93
US5047837ASep 10, 1991
Semiconductor device with heat transfer cap
HITACHI LTD46 citations93
US6501160B1Dec 31, 2002
Semiconductor device and a method of manufacturing the same and a mount structure
HITACHI LTD23 citations92
USRE37690EMay 7, 2002
Lead frame and semiconductor device
HITACHI LTD25 citations91
US4095253AJun 13, 1978
Single in-line high power resin-packaged semiconductor device having an improved heat dissipator
HITACHI LTD33 citations91
US6492739B2Dec 10, 2002
Semiconductor device having bumper portions integral with a heat sink
HITACHI LTD12 citations81
US4907129AMar 6, 1990
Lead frame and electronic divice
HITACHI LTD7 citations74
US4797787AJan 10, 1989
Lead frame and electronic device
HITACHI LTD9 citations74
US6392308B2May 21, 2002
Semiconductor device having bumper portions integral with a heat sink
HITACHI LTD4 citations73
US6320270B1Nov 20, 2001
Semiconductor device and method of producing the same
HITACHI LTD7 citations73
US6104085AAug 15, 2000
Semiconductor device and method of producing the same
HITACHI LTD9 citations73
US5121300AJun 9, 1992
Lead frame and electronic device employing the same
HITACHI LTD4 citations63
RENESAS TECH CORP
13 patentsUS6992385B2Jan 31, 2006
Semiconductor device, a method of manufacturing the same and an electronic device
RENESAS TECH CORP47 citations96
US6882047B2Apr 19, 2005
Semiconductor package including a plurality of semiconductor chips therein
RENESAS TECH CORP38 citations93
US7220617B2May 22, 2007
Semiconductor device and method of manufacturing the same
RENESAS TECH CORP21 citations92
US7732919B2Jun 8, 2010
Semiconductor device
RENESAS TECH CORP10 citations83
US7432594B2Oct 7, 2008
Semiconductor chip, electrically connections therefor
RENESAS TECH CORP17 citations83
US7405469B2Jul 29, 2008
Semiconductor device and method of manufacturing the same
RENESAS TECH CORP12 citations83
US7374965B2May 20, 2008
Manufacturing method of semiconductor device
RENESAS TECH CORP14 citations83
US7692285B2Apr 6, 2010
Semiconductor device
RENESAS TECH CORP11 citations82
US6849933B2Feb 1, 2005
Semiconductor mounting device and method of manufacturing the same
RENESAS TECH CORP9 citations74
US6838315B2Jan 4, 2005
Semiconductor device manufacturing method wherein electrode members are exposed from a mounting surface of a resin encapsulator
RENESAS TECH CORP9 citations73
US7728416B2Jun 1, 2010
Semiconductor device, a method of manufacturing the same and an electronic device
RENESAS TECH CORP2 citations63
US7763967B2Jul 27, 2010
Semiconductor device with surface mounting terminals
RENESAS TECH CORP0 citations52
US6710429B2Mar 23, 2004
Semiconductor device and process for production thereof
RENESAS TECH CORP1 citations51
RENESAS ELECTRONICS CORP
3 patentsUS8022518B2Sep 20, 2011
Semiconductor device having a sealing body and partially exposed conductors
RENESAS ELECTRONICS CORP2 citations63
US7955902B2Jun 7, 2011
Manufacturing method of semiconductor device with surface mounting terminals
RENESAS ELECTRONICS CORP4 citations63
US7969000B2Jun 28, 2011
Semiconductor device
RENESAS ELECTRONICS CORP1 citations51