Inventor
SUZUKI MOTOJI
JP12 patents
⚠️ This page may combine multiple inventors who share the name “SUZUKI MOTOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
9 patentsUS6049038AApr 11, 2000
Flip-chip resin sealing structure and resin sealing method
NEC CORP66 citations95
US5668058ASep 16, 1997
Method of producing a flip chip
NEC CORP23 citations92
US5925445AJul 20, 1999
Printed wiring board
NEC CORP39 citations91
US6857361B2Feb 22, 2005
Method and apparatus for printing solder paste of different thickness on lands on printed circuit board
NEC CORP16 citations84
US6617529B2Sep 9, 2003
Circuit board and electronic equipment using the same
NEC CORP8 citations70
US7057293B2Jun 6, 2006
Structure comprising a printed circuit board with electronic components mounted thereon and a method for manufacturing the same
NEC CORP3 citations63
US6929973B2Aug 16, 2005
Method of packaging electronic components with high reliability
NEC CORP1 citations52
US6915942B2Jul 12, 2005
Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy
NEC CORP0 citations52
US7013557B2Mar 21, 2006
Method of packaging electronic components without creating unnecessary solder balls
NEC CORP0 citations42