Inventor
SAEKI JUNICHI
JP47 patents
⚠️ This page may combine multiple inventors who share the name “SAEKI JUNICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
38 patentsUS5068712ANov 26, 1991
Semiconductor device
HITACHI LTD165 citations99
US6291880B1Sep 18, 2001
Semiconductor device including an integrally molded lead frame
HITACHI LTD160 citations97
US6081023AJun 27, 2000
Semiconductor device
HITACHI LTD28 citations96
US5914531AJun 22, 1999
Semiconductor device having a ball grid array package structure using a supporting frame
HITACHI LTD68 citations96
US5793099AAug 11, 1998
Semiconductor device
HITACHI LTD30 citations96
US5612569AMar 18, 1997
Semiconductor device
HITACHI LTD35 citations96
US5530286AJun 25, 1996
Semiconductor device
HITACHI LTD53 citations96
US5358904AOct 25, 1994
Semiconductor device
HITACHI LTD47 citations96
US5811877ASep 22, 1998
Semiconductor device structure
HITACHI LTD84 citations95
US5371044ADec 6, 1994
Method of uniformly encapsulating a semiconductor device in resin
HITACHI LTD60 citations95
US4989166AJan 29, 1991
Method for synthesizing analysis model and flow analysis system
HITACHI LTD66 citations95
US5200366AApr 6, 1993
Semiconductor device, its fabrication method and molding apparatus used therefor
HITACHI LTD60 citations94
US6130114AOct 10, 2000
Semiconductor device
HITACHI LTD17 citations93
US6100580AAug 8, 2000
Semiconductor device having all outer leads extending from one side of a resin member
HITACHI LTD17 citations93
US6018191AJan 25, 2000
Semiconductor device
HITACHI LTD18 citations93
US4983110AJan 8, 1991
Resin encapsulating apparatus for semiconductor devices
HITACHI LTD23 citations93
US4954301ASep 4, 1990
Transfer molding process and an apparatus for the same
HITACHI LTD31 citations93
US4946633AAug 7, 1990
Method of producing semiconductor devices
HITACHI LTD32 citations93
US4900501AFeb 13, 1990
Method and apparatus for encapsulating semi-conductors
HITACHI LTD31 citations93
US6465876B1Oct 15, 2002
Semiconductor device and lead frame therefor
HITACHI LTD16 citations92
US6114192ASep 5, 2000
Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame
HITACHI LTD39 citations92
US5572430ANov 5, 1996
Method and apparatus for cooperated design
HITACHI LTD75 citations92
US4426341AJan 17, 1984
Transfer molding method and transfer molding machine
HITACHI LTD34 citations92
US5287284AFeb 15, 1994
Product specification complex analysis system
HITACHI LTD41 citations91
US6326681B1Dec 4, 2001
Semiconductor device
HITACHI LTD14 citations82
US6303982B2Oct 16, 2001
Semiconductor device
HITACHI LTD10 citations82
US6072231AJun 6, 2000
Semiconductor device
HITACHI LTD12 citations82
US6069029AMay 30, 2000
Semiconductor device chip on lead and lead on chip manufacturing
HITACHI LTD13 citations82
US5981315ANov 9, 1999
Semiconductor device
HITACHI LTD7 citations82
US5914530AJun 22, 1999
Semiconductor device
HITACHI LTD15 citations82
US5863817AJan 26, 1999
Semiconductor device
HITACHI LTD7 citations82
US5821606AOct 13, 1998
Semiconductor device
HITACHI LTD9 citations82
US7096083B2Aug 22, 2006
Design support apparatus and method for supporting design of resin mold product
HITACHI LTD11 citations80
US6124629ASep 26, 2000
Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip
HITACHI LTD3 citations74
US5125821AJun 30, 1992
Resin flow and curing measuring device
HITACHI LTD19 citations73
US7277771B2Oct 2, 2007
Three-dimensional foam analysis method, product design aiding method using the analysis method, and recording medium recording these methods
HITACHI LTD3 citations63
US6100115AAug 8, 2000
Semiconductor device
HITACHI LTD1 citations63
US6204552B1Mar 20, 2001
Semiconductor device
HITACHI LTD0 citations52
RENESAS TECH CORP
6 patentsUS6720208B2Apr 13, 2004
Semiconductor device
RENESAS TECH CORP2 citations74
US6686226B1Feb 3, 2004
Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame
RENESAS TECH CORP9 citations73
US6844219B2Jan 18, 2005
Semiconductor device and lead frame therefor
RENESAS TECH CORP2 citations63
US6861294B2Mar 1, 2005
Semiconductor devices and methods of making the devices
RENESAS TECH CORP4 citations62
US7023027B2Apr 4, 2006
Diode package having an anode and a cathode formed on one surface of a diode chip
RENESAS TECH CORP4 citations60
US6919622B2Jul 19, 2005
Semiconductor device
RENESAS TECH CORP0 citations52