P

Inventor

WEI HSIU-PING

TW8 patents
⚠️ This page may combine multiple inventors who share the name “WEI HSIU-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

3 patents
US8907478B2Dec 9, 2014

Bump pad structure

TAIWAN SEMICONDUCTOR MFG9 citations84
US8030776B2Oct 4, 2011

Integrated circuit with protective structure

TAIWAN SEMICONDUCTOR MFG2 citations63
US9171811B2Oct 27, 2015

Bump pad structure

TAIWAN SEMICONDUCTOR MFG0 citations52

LIU TZUAN-HORNG

2 patents
US8193639B2Jun 5, 2012

Dummy metal design for packaging structures

LIU TZUAN-HORNG8 citations83
US8753971B2Jun 17, 2014

Dummy metal design for packaging structures

LIU TZUAN-HORNG3 citations62

TSAI HAO-YI

1 patent
US8405211B2Mar 26, 2013

Bump pad structure

TSAI HAO-YI23 citations91

TAIWAN SEMICONDUCTOR MFG CO LTD

1 patent
US9536847B2Jan 3, 2017

Bump pad structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62

WEI HSIU-PING

1 patent
US8227916B2Jul 24, 2012

Package structure and method for reducing dielectric layer delamination

WEI HSIU-PING5 citations57