Inventor

YANG CHIH-KAI

TW79 patents

⚠️ This page may combine multiple inventors who share the name “YANG CHIH-KAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INVENTEC CORP

15 patents

US7388747B2Jun 17, 2008

Heat plate fixing structure

INVENTEC CORP28 citations92

US7212404B2May 1, 2007

Integrated heat sink device

INVENTEC CORP36 citations92

US7405937B1Jul 29, 2008

Heat sink module for dual heat sources

INVENTEC CORP34 citations90

US7436673B2Oct 14, 2008

Heat sink fixing assembly

INVENTEC CORP14 citations84

US7319592B2Jan 15, 2008

Recyclable protective cover for a heat-conductive medium

INVENTEC CORP16 citations84

US7274572B2Sep 25, 2007

Supporting plate

INVENTEC CORP13 citations84

US7558062B2Jul 7, 2009

Heat-dissipating module and electronic apparatus

INVENTEC CORP17 citations81

US7564686B2Jul 21, 2009

Heat-dissipating module

INVENTEC CORP7 citations74

US7277293B2Oct 2, 2007

Heat sink conduction apparatus

INVENTEC CORP9 citations74

US8363400B2Jan 29, 2013

Circuit module and electronic device using the same

INVENTEC CORP2 citations63

US7463484B2Dec 9, 2008

Heatsink apparatus

INVENTEC CORP5 citations63

US7457119B2Nov 25, 2008

Heatsink module

INVENTEC CORP5 citations63

US7400507B2Jul 15, 2008

Fastening structure

INVENTEC CORP4 citations63

US7265990B2Sep 4, 2007

Chipset coupling apparatus

INVENTEC CORP4 citations63

US7248474B2Jul 24, 2007

Fool-proof device on heatsink thermal module for the notebook computer

INVENTEC CORP2 citations63

TAIWAN SEMICONDUCTOR MFG CO LTD

10 patents

US11978677B2May 7, 2024

Wafer positioning method and apparatus

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations75

US12557602B2Feb 17, 2026

Wafer positioning method and apparatus

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12315753B2May 27, 2025

Wafer positioning method and apparatus

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12191174B2Jan 7, 2025

Semiconductor processing tool and method of using an embedded chamber

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US11854853B2Dec 26, 2023

Wafer positioning method and apparatus

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12347681B2Jul 1, 2025

Method of forming a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12300506B2May 13, 2025

Method of manufacturing semiconductor devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12094691B2Sep 17, 2024

Etch apparatus for compensating shifted overlayers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US11978640B2May 7, 2024

Method of manufacturing semiconductor devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US11776810B2Oct 3, 2023

Method of forming a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62

INVENTEC PUDONG TECH CORP

7 patents

US9740253B2Aug 22, 2017

Electronic apparatus

INVENTEC PUDONG TECH CORP35 citations93

US11877381B2Jan 16, 2024

Heat dissipating system

INVENTEC PUDONG TECH CORP7 citations86

US12213277B2Jan 28, 2025

Air cooling system

INVENTEC PUDONG TECH CORP2 citations75

US11337317B2May 17, 2022

Server device

INVENTEC PUDONG TECH CORP4 citations73

US9382919B2Jul 5, 2016

Fan blade structure

INVENTEC PUDONG TECH CORP5 citations73

US10948246B1Mar 16, 2021

Heat dissipation system

INVENTEC PUDONG TECH CORP6 citations67

US9029696B2May 12, 2015

Electronic device

INVENTEC PUDONG TECH CORP3 citations63

FOXCONN INTERCONNECT TECHNOLOGY LTD

6 patents

US9350126B2May 24, 2016

Electrical connector having a receptacle with a shielding plate and a mating plug with metallic side arms

FOXCONN INTERCONNECT TECHNOLOGY LTD69 citations98

US9502821B2Nov 22, 2016

Flippable electrical connector

FOXCONN INTERCONNECT TECHNOLOGY LTD45 citations94

US9608391B2Mar 28, 2017

Flippable electrical connector

FOXCONN INTERCONNECT TECHNOLOGY LTD14 citations93

US9472910B2Oct 18, 2016

Flippable electrical connector

FOXCONN INTERCONNECT TECHNOLOGY LTD20 citations93

US9762009B2Sep 12, 2017

Plug connector insertable in two orientations and having a metallic shield plate with arms with hook structures

FOXCONN INTERCONNECT TECHNOLOGY LTD6 citations84

US9705267B2Jul 11, 2017

Electrical connector with grounding plate retained therein

FOXCONN INTERCONNECT TECHNOLOGY LTD11 citations84

HON HAI PREC IND CO LTD

4 patents

US9270035B2Feb 23, 2016

Carrier and carrier assembly used thereof for positioning IC package

HON HAI PREC IND CO LTD11 citations84

US9214754B2Dec 15, 2015

Holding device used for electrical connector

HON HAI PREC IND CO LTD11 citations84

US8033872B2Oct 11, 2011

Contact terminal for test socket

HON HAI PREC IND CO LTD14 citations84

US9332666B2May 3, 2016

Electrical connector having an improved stiffener

HON HAI PREC IND CO LTD2 citations63

MACRONIX INT CO LTD

4 patents

US9748332B1Aug 29, 2017

Non-volatile semiconductor memory

MACRONIX INT CO LTD8 citations83

US11411020B2Aug 9, 2022

Memory device with sub-slits

MACRONIX INT CO LTD2 citations73

US12581654B2Mar 17, 2026

Memory device

MACRONIX INT CO LTD0 citations62

US12069861B2Aug 20, 2024

Memory device with reduced bending stack

MACRONIX INT CO LTD0 citations62

CHEN KE-HAO

1 patent

US8262419B2Sep 11, 2012

Contact for electric connector and method of making the same

CHEN KE-HAO17 citations83

MEDIATEK INC

1 patent

US11490283B2Nov 1, 2022

L1-SINR measurement period based on channel measurement resource (CMR) and interference measurement resource (IMR)

MEDIATEK INC2 citations73

FOXCONN KUNSHAN COMPUTER CONNECTOR CO LTD

1 patent

US11831094B2Nov 28, 2023

Electrical connector assembly including a back plate having a curved inner region and a flat outer region

FOXCONN KUNSHAN COMPUTER CONNECTOR CO LTD2 citations72

WANG FENG-KU

1 patent

US8641271B2Feb 4, 2014

Method for testing heat pipes

WANG FENG-KU4 citations72

Showing the top 50 of 79 patents by PatentIndex Score.