Inventor
HAGIWARA TSUNEYUKI
JP37 patents
⚠️ This page may combine multiple inventors who share the name “HAGIWARA TSUNEYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIKON CORP
31 patentsUS7230680B2Jun 12, 2007
Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation method
NIKON CORP109 citations99
US6992751B2Jan 31, 2006
Scanning exposure apparatus
NIKON CORP175 citations98
US5764363AJun 9, 1998
Apparatus for observing a surface using polarized light
NIKON CORP137 citations97
US6727980B2Apr 27, 2004
Apparatus and method for pattern exposure and method for adjusting the apparatus
NIKON CORP55 citations96
US5838433ANov 17, 1998
Apparatus for detecting defects on a mask
NIKON CORP71 citations96
US5798831AAug 25, 1998
Defect inspecting apparatus and defect inspecting method
NIKON CORP61 citations96
US6381004B1Apr 30, 2002
Exposure apparatus and device manufacturing method
NIKON CORP64 citations95
US5436464AJul 25, 1995
Foreign particle inspecting method and apparatus with correction for pellicle transmittance
NIKON CORP73 citations93
US6538721B2Mar 25, 2003
Scanning exposure apparatus
NIKON CORP23 citations92
US5907396AMay 25, 1999
Optical detection system for detecting defects and/or particles on a substrate
NIKON CORP25 citations92
US5790251AAug 4, 1998
Defect inspecting apparatus
NIKON CORP50 citations92
US5680207AOct 21, 1997
Defect inspecting apparatus and defect inspecting method
NIKON CORP43 citations92
US5629768AMay 13, 1997
Defect inspecting apparatus
NIKON CORP25 citations92
US5623340AApr 22, 1997
Foreign particle inspection apparatus
NIKON CORP22 citations92
US5471066ANov 28, 1995
Defect inspection apparatus of rotary type
NIKON CORP51 citations92
US5363187ANov 8, 1994
Light scanning apparatus for detecting foreign particles on surface having circuit pattern
NIKON CORP45 citations92
US7965387B2Jun 21, 2011
Image plane measurement method, exposure method, device manufacturing method, and exposure apparatus
NIKON CORP12 citations84
US7791718B2Sep 7, 2010
Measurement method, exposure method, and device manufacturing method
NIKON CORP7 citations74
US5736735AApr 7, 1998
Optical scanning device and foreign matter inspection apparatus
NIKON CORP11 citations74
US5646725AJul 8, 1997
Foreign matter inspection apparatus for large-scale substrate
NIKON CORP13 citations74
US5442189AAug 15, 1995
Apparatus for inspecting defects and foreign substances having a spot illuminated focusing system
NIKON CORP14 citations74
US5365330ANov 15, 1994
Foreign particle inspection apparatus
NIKON CORP9 citations74
US5149982ASep 22, 1992
Foreign particle inspection apparatus
NIKON CORP13 citations74
US7081946B2Jul 25, 2006
Holding apparatus, holding method, exposure apparatus and device manufacturing method
NIKON CORP8 citations72
US7566893B2Jul 28, 2009
Best focus detection method, exposure method, and exposure apparatus
NIKON CORP7 citations66
US5695268ADec 9, 1997
Light source apparatus
NIKON CORP4 citations63
US11928794B2Mar 12, 2024
Image processing device, image processing program, image processing method, and imaging device
NIKON CORP0 citations62
US10025194B2Jul 17, 2018
Exposure apparatus, exposure method, and method for producing device
NIKON CORP1 citations61
US9513558B2Dec 6, 2016
Exposure apparatus, exposure method, and method for producing device
NIKON CORP1 citations61
US8749759B2Jun 10, 2014
Exposure apparatus, exposure method, and method for producing device
NIKON CORP1 citations61
US7070888B2Jul 4, 2006
Method of selecting photomask blank substrates
NIKON CORP0 citations50
TOSHIBA KK
2 patentsUS7474386B2Jan 6, 2009
Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation method
TOSHIBA KK14 citations92
US7365830B2Apr 29, 2008
Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation method
TOSHIBA KK4 citations63