Inventor
REDDY SRINIVASA S N
US46 patents
⚠️ This page may combine multiple inventors who share the name “REDDY SRINIVASA S N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
43 patentsUS6319829B1Nov 20, 2001
Enhanced interconnection to ceramic substrates
IBM79 citations96
US6136419AOct 24, 2000
Ceramic substrate having a sealed layer
IBM74 citations95
US6339527B1Jan 15, 2002
Thin film capacitor on ceramic
IBM41 citations92
US6312791B1Nov 6, 2001
Multilayer ceramic substrate with anchored pad
IBM36 citations92
US6187418B1Feb 13, 2001
Multilayer ceramic substrate with anchored pad
IBM40 citations92
US5468445ANov 21, 1995
Ceramic via composition, multilayer ceramic circuit containing same, and process for using same
IBM20 citations92
US5292477AMar 8, 1994
Supersaturation method for producing metal powder with a uniform distribution of dispersants method of uses thereof and structures fabricated therewith
IBM20 citations92
US5139851AAug 18, 1992
Low dielectric composite substrate
IBM22 citations92
US5135595AAug 4, 1992
Process for fabricating a low dielectric composite substrate
IBM24 citations91
US5073180ADec 17, 1991
Method for forming sealed co-fired glass ceramic structures
IBM42 citations91
US7344679B2Mar 18, 2008
Method and apparatus for point of care osmolarity testing
IBM23 citations89
US6124041ASep 26, 2000
Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
IBM35 citations89
US5869134AFeb 9, 1999
CVD of metals capable of receiving nickel or alloys thereof using iodide
IBM19 citations84
US5277725AJan 11, 1994
Process for fabricating a low dielectric composite substrate
IBM17 citations81
US4764341AAug 16, 1988
Bonding of pure metal films to ceramics
IBM22 citations81
US5925443AJul 20, 1999
Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
IBM14 citations79
US5639562AJun 17, 1997
Co-sintered surface metallization for pin-join, wire-bond and chip attach
IBM4 citations74
US5139975AAug 18, 1992
Sintering arrangement for enhancing removal of carbon from ceramic substrate laminates
IBM12 citations74
US5053361AOct 1, 1991
Setter tile for use in sintering of ceramic substrate laminates
IBM10 citations74
US5532031AJul 2, 1996
I/O pad adhesion layer for a ceramic substrate
IBM17 citations73
US5525761AJun 11, 1996
Copper-based paste containing refractory metal additions for densification control
IBM7 citations73
US5512711AApr 30, 1996
Copper-based paste containing refractory metal additions for densification control
IBM6 citations73
US5336444AAug 9, 1994
Ceramic via composition, multilayer ceramic circuit containing same, and process for using same
IBM14 citations73
US5304517AApr 19, 1994
Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering
IBM11 citations73
US4971738ANov 20, 1990
Enhanced removal of carbon from ceramic substrate laminates
IBM16 citations73
US6413339B1Jul 2, 2002
Low temperature sintering of ferrite materials
IBM7 citations71
US6569496B1May 27, 2003
CVD of metals capable of receiving nickel or alloys thereof using inert contact
IBM10 citations70
US6224682B1May 1, 2001
CVD of metals capable of receiving nickel or alloys thereof using inert contact
IBM5 citations70
US6653776B1Nov 25, 2003
Discrete magnets in dielectric forming metal/ceramic laminate and process thereof
IBM4 citations63
US6565917B1May 20, 2003
Method of forming features on a ceramic substrate using platible pastes
IBM3 citations63
US6494758B1Dec 17, 2002
Process of forming metal/ferrite laminated magnet
IBM5 citations63
US5655213AAug 5, 1997
Co-sintered surface metallization for pin-join, wire-bond and chip attach
IBM4 citations63
US5613181AMar 18, 1997
Co-sintered surface metallization for pin-join, wire-bond and chip attach
IBM1 citations63
US4659406AApr 21, 1987
Method of bonding to ceramic and glass
IBM2 citations63
US6227943B1May 8, 2001
Method and system for pre-cleaning and post-cleaning deposited metal
IBM3 citations62
US5167913ADec 1, 1992
Method of forming an adherent layer of metallurgy on a ceramic substrate
IBM6 citations62
US6376054B1Apr 23, 2002
Surface metallization structure for multiple chip test and burn-in
IBM5 citations61
US6358439B1Mar 19, 2002
Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
IBM1 citations60
US6974358B2Dec 13, 2005
Discrete magnets in dielectric forming metal/ceramic laminate and process thereof
IBM1 citations52
US6068912AMay 30, 2000
Platible non-metallic filler material for metallurgical screening paste
IBM0 citations52
US8910853B2Dec 16, 2014
Additives for grain fragmentation in Pb-free Sn-based solder
IBM0 citations51
US7683493B2Mar 23, 2010
Intermetallic diffusion block device and method of manufacture
IBM0 citations46
US7666780B2Feb 23, 2010
Alignment verification for C4NP solder transfer
IBM0 citations39