Inventor
KAO CHIEN-TEH
US51 patents
⚠️ This page may combine multiple inventors who share the name “KAO CHIEN-TEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
42 patentsUS10400335B2Sep 3, 2019
Dual-direction chemical delivery system for ALD/CVD chambers
APPLIED MATERIALS INC363 citations99
US9765432B2Sep 19, 2017
Dual-direction chemical delivery system for ALD/CVD chambers
APPLIED MATERIALS INC362 citations99
US9353440B2May 31, 2016
Dual-direction chemical delivery system for ALD/CVD chambers
APPLIED MATERIALS INC373 citations99
US7494545B2Feb 24, 2009
Epitaxial deposition process and apparatus
APPLIED MATERIALS INC246 citations99
USRE47440EJun 18, 2019
Apparatus and method for providing uniform flow of gas
APPLIED MATERIALS INC360 citations98
US7939422B2May 10, 2011
Methods of thin film process
APPLIED MATERIALS INC240 citations98
US7871926B2Jan 18, 2011
Methods and systems for forming at least one dielectric layer
APPLIED MATERIALS INC77 citations98
US7520957B2Apr 21, 2009
Lid assembly for front end of line fabrication
APPLIED MATERIALS INC162 citations98
US7396480B2Jul 8, 2008
Method for front end of line fabrication
APPLIED MATERIALS INC285 citations98
US6461435B1Oct 8, 2002
Showerhead with reduced contact area
APPLIED MATERIALS INC600 citations98
US6271148B1Aug 7, 2001
Method for improved remote microwave plasma source for use with substrate processing system
APPLIED MATERIALS INC647 citations98
US7604708B2Oct 20, 2009
Cleaning of native oxide with hydrogen-containing radicals
APPLIED MATERIALS INC226 citations97
US6603269B1Aug 5, 2003
Resonant chamber applicator for remote plasma source
APPLIED MATERIALS INC252 citations97
US6645884B1Nov 11, 2003
Method of forming a silicon nitride layer on a substrate
APPLIED MATERIALS INC61 citations96
US6125859AOct 3, 2000
Method for improved cleaning of substrate processing systems
APPLIED MATERIALS INC131 citations96
US6026762AFeb 22, 2000
Apparatus for improved remote microwave plasma source for use with substrate processing systems
APPLIED MATERIALS INC54 citations95
US9551070B2Jan 24, 2017
In-situ corrosion resistant substrate support coating
APPLIED MATERIALS INC20 citations90
US7994002B2Aug 9, 2011
Method and apparatus for trench and via profile modification
APPLIED MATERIALS INC7 citations84
US7780793B2Aug 24, 2010
Passivation layer formation by plasma clean process to reduce native oxide growth
APPLIED MATERIALS INC19 citations84
US7867789B2Jan 11, 2011
Contact clean by remote plasma and repair of silicide surface
APPLIED MATERIALS INC7 citations82
US7550381B2Jun 23, 2009
Contact clean by remote plasma and repair of silicide surface
APPLIED MATERIALS INC12 citations82
US12362149B2Jul 15, 2025
Film stress control for plasma enhanced chemical vapor deposition
APPLIED MATERIALS INC1 citations74
US9109754B2Aug 18, 2015
Apparatus and method for providing uniform flow of gas
APPLIED MATERIALS INC4 citations73
US11854771B2Dec 26, 2023
Film stress control for plasma enhanced chemical vapor deposition
APPLIED MATERIALS INC1 citations72
US11094508B2Aug 17, 2021
Film stress control for plasma enhanced chemical vapor deposition
APPLIED MATERIALS INC3 citations72
US10312475B2Jun 4, 2019
CVD thin film stress control method for display application
APPLIED MATERIALS INC3 citations72
US9982343B2May 29, 2018
Apparatus for providing plasma to a process chamber
APPLIED MATERIALS INC3 citations72
US10697062B2Jun 30, 2020
Gas flow guide design for uniform flow distribution and efficient purge
APPLIED MATERIALS INC3 citations71
US9881787B2Jan 30, 2018
Deposition methods for uniform and conformal hybrid titanium oxide films
APPLIED MATERIALS INC2 citations69
US6933021B2Aug 23, 2005
Method of TiSiN deposition using a chemical vapor deposition (CVD) process
APPLIED MATERIALS INC11 citations69
US11664216B2May 30, 2023
ALD process and hardware with improved purge efficiency
APPLIED MATERIALS INC0 citations63
US10964533B2Mar 30, 2021
ALD process and hardware with improved purge efficiency
APPLIED MATERIALS INC0 citations63
US7955510B2Jun 7, 2011
Oxide etch with NH4-NF3 chemistry
APPLIED MATERIALS INC6 citations63
US12394595B2Aug 19, 2025
Multi-antenna unit for large area inductively coupled plasma processing apparatus
APPLIED MATERIALS INC0 citations62
USRE48994EMar 29, 2022
Apparatus and method for providing uniform flow of gas
APPLIED MATERIALS INC0 citations62
US8043933B2Oct 25, 2011
Integration sequences with top surface profile modification
APPLIED MATERIALS INC1 citations52
US7977246B2Jul 12, 2011
Thermal annealing method for preventing defects in doped silicon oxide surfaces during exposure to atmosphere
APPLIED MATERIALS INC0 citations52
US11306393B2Apr 19, 2022
Methods and apparatus for ALD processes
APPLIED MATERIALS INC0 citations51
US10879090B2Dec 29, 2020
High temperature process chamber lid
APPLIED MATERIALS INC0 citations51
US9831109B2Nov 28, 2017
High temperature process chamber lid
APPLIED MATERIALS INC0 citations51
US9627185B2Apr 18, 2017
Methods and apparatus for in-situ cleaning of a process chamber
APPLIED MATERIALS INC1 citations51
US7910853B2Mar 22, 2011
Direct real-time monitoring and feedback control of RF plasma output for wafer processing
APPLIED MATERIALS INC0 citations51
KAO CHIEN-TEH
3 patentsUS8846163B2Sep 30, 2014
Method for removing oxides
KAO CHIEN-TEH190 citations98
US9004006B2Apr 14, 2015
Process chamber lid design with built-in plasma source for short lifetime species
KAO CHIEN-TEH5 citations71
US8318605B2Nov 27, 2012
Plasma treatment method for preventing defects in doped silicon oxide surfaces during exposure to atmosphere
KAO CHIEN-TEH1 citations51
LU XINLIANG
2 patentsAPPPLIED MATERIALS INC
1 patentKAO CHIEN TEH
1 patentCHANG MEI
1 patentShowing the top 50 of 51 patents by PatentIndex Score.