Inventor
LAI CHIUKIN STEVEN
US18 patents
⚠️ This page may combine multiple inventors who share the name “LAI CHIUKIN STEVEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
11 patentsUS9362163B2Jun 7, 2016
Methods and apparatuses for atomic layer cleaning of contacts and vias
LAM RES CORP109 citations96
US9972504B2May 15, 2018
Atomic layer etching of tungsten for enhanced tungsten deposition fill
LAM RES CORP21 citations94
US10777453B2Sep 15, 2020
Low resistivity films containing molybdenum
LAM RES CORP18 citations93
US10510590B2Dec 17, 2019
Low resistivity films containing molybdenum
LAM RES CORP26 citations93
US9748137B2Aug 29, 2017
Method for void-free cobalt gap fill
LAM RES CORP26 citations93
US10731250B2Aug 4, 2020
Depositing ruthenium layers in interconnect metallization
LAM RES CORP12 citations86
US11069535B2Jul 20, 2021
Atomic layer etch of tungsten for enhanced tungsten deposition fill
LAM RES CORP7 citations84
US10283404B2May 7, 2019
Selective deposition of WCN barrier/adhesion layer for interconnect
LAM RES CORP19 citations82
US10438847B2Oct 8, 2019
Manganese barrier and adhesion layers for cobalt
LAM RES CORP6 citations73
US12334351B2Jun 17, 2025
Molybdenum deposition
LAM RES CORP3 citations72
US10229826B2Mar 12, 2019
Systems and methods for forming low resistivity metal contacts and interconnects by reducing and removing metallic oxide
LAM RES CORP4 citations70