Inventor
HUSTON JOEL M
US21 patents
⚠️ This page may combine multiple inventors who share the name “HUSTON JOEL M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
18 patentsUS10400335B2Sep 3, 2019
Dual-direction chemical delivery system for ALD/CVD chambers
APPLIED MATERIALS INC363 citations99
US9765432B2Sep 19, 2017
Dual-direction chemical delivery system for ALD/CVD chambers
APPLIED MATERIALS INC362 citations99
US9353440B2May 31, 2016
Dual-direction chemical delivery system for ALD/CVD chambers
APPLIED MATERIALS INC373 citations99
US7520957B2Apr 21, 2009
Lid assembly for front end of line fabrication
APPLIED MATERIALS INC162 citations98
US7396480B2Jul 8, 2008
Method for front end of line fabrication
APPLIED MATERIALS INC285 citations98
US6083321AJul 4, 2000
Fluid delivery system and method
APPLIED MATERIALS INC583 citations95
US8343307B2Jan 1, 2013
Showerhead assembly
APPLIED MATERIALS INC15 citations92
US6179277B1Jan 30, 2001
Liquid vaporizer systems and methods for their use
APPLIED MATERIALS INC33 citations92
US6332601B1Dec 25, 2001
Liquid vaporizers for semiconductor processing systems
APPLIED MATERIALS INC6 citations73
US9837250B2Dec 5, 2017
Hot wall reactor with cooled vacuum containment
APPLIED MATERIALS INC4 citations72
US9543186B2Jan 10, 2017
Substrate support with controlled sealing gap
APPLIED MATERIALS INC3 citations72
US6926774B2Aug 9, 2005
Piezoelectric vaporizer
APPLIED MATERIALS INC5 citations60
US11955362B2Apr 9, 2024
Substrate support for reduced damage substrate backside
APPLIED MATERIALS INC0 citations52
US11598003B2Mar 7, 2023
Substrate processing chamber having heated showerhead assembly
APPLIED MATERIALS INC0 citations52
US10879090B2Dec 29, 2020
High temperature process chamber lid
APPLIED MATERIALS INC0 citations51
US9831109B2Nov 28, 2017
High temperature process chamber lid
APPLIED MATERIALS INC0 citations51
US9627185B2Apr 18, 2017
Methods and apparatus for in-situ cleaning of a process chamber
APPLIED MATERIALS INC1 citations51
US7910853B2Mar 22, 2011
Direct real-time monitoring and feedback control of RF plasma output for wafer processing
APPLIED MATERIALS INC0 citations51