Inventor
SEGAWA TADANORI
JP10 patents
⚠️ This page may combine multiple inventors who share the name “SEGAWA TADANORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS TECH CORP
6 patentsUS7183650B2Feb 27, 2007
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate
RENESAS TECH CORP30 citations92
US6888230B1May 3, 2005
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device
RENESAS TECH CORP16 citations92
US6946723B2Sep 20, 2005
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP13 citations84
US7217992B2May 15, 2007
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device
RENESAS TECH CORP3 citations63
US7378333B2May 27, 2008
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP0 citations52
US7535106B2May 19, 2009
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate
RENESAS TECH CORP1 citations51
HITACHI LTD
4 patentsUS6621154B1Sep 16, 2003
Semiconductor apparatus having stress cushioning layer
HITACHI LTD65 citations96
US4933744AJun 12, 1990
Resin encapsulated electronic devices
HITACHI LTD72 citations96
US6348741B1Feb 19, 2002
Semiconductor apparatus and a manufacturing method thereof
HITACHI LTD25 citations92
US4965657AOct 23, 1990
Resin encapsulated semiconductor device
HITACHI LTD13 citations73