Inventor

YEN LIANG-JU

TW3 patents

⚠️ This page may combine multiple inventors who share the name “YEN LIANG-JU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

2 patents

US11393805B2Jul 19, 2022

3D semiconductor packages

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71

US12224276B2Feb 11, 2025

3D semiconductor packages

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61

YU CHUN HUI

1 patent

US9583365B2Feb 28, 2017

Method of forming interconnects for three dimensional integrated circuit

YU CHUN HUI4 citations69