Inventor

SUNDLOF BRIAN R

US36 patents

⚠️ This page may combine multiple inventors who share the name “SUNDLOF BRIAN R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUNDLOF BRIAN R

IBM

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

Method and apparatus for forming stacked die and substrate structures for increased packing density

Method and apparatus for forming stacked die and substrate structures for increased packing density

Multilayer pillar for reduced stress interconnect and method of making same

Multilayer pillar for reduced stress interconnect and method of making same

Multilayer pillar for reduced stress interconnect and method of making same

Method and apparatus for filling vias

Multi terminal capacitor within input output path of semiconductor package interconnect

Determining crackstop strength of integrated circuit assembly at the wafer level

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

Suspension for filling via holes in silicon and method for making the same

Multilayer pillar for reduced stress interconnect and method of making same

Multilayer pillar for reduced stress interconnect and method of making same

Electronic package repair process

Method of selective plating on a substrate

Multi terminal capacitor within input output path of semiconductor package interconnect

Multi terminal capacitor within input output path of semiconductor package interconnect

Multi terminal capacitor within input output path of semiconductor package interconnect

Multilayer pillar for reduced stress interconnect and method of making same

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

Suspension for filling via holes in silicon and method for making the same

Additives for grain fragmentation in Pb-free Sn-based solder

Compliant penetrating packaging interconnect

Method and process for reducing undercooling in a lead-free tin-rich solder alloy

Method and process for reducing undercooling in a lead-free tin-rich solder alloy

Electronic package repair process

Intermetallic diffusion block device and method of manufacture

JADHAV VIRENDRA R

Multilayer pillar for reduced stress interconnect and method of making same

Multilayer pillar for reduced stress interconnect and method of making same

Multilayer pillar for reduced stress interconnect and method of making same

ARVIN CHARLES L

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

Additives for grain fragmentation in Pb-free Sn-based solder

HOUGHAM GARETH

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

BUSBY JAMES A

Optimization of metallurgical properties of a solder joint