Inventor

KATOU HIROTAKA

JP2 patents

⚠️ This page may combine multiple inventors who share the name “KATOU HIROTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOMATSU ELECTRONICS METALS CO

1 patent

US5953620ASep 14, 1999

Method for fabricating a bonded SOI wafer

KOMATSU ELECTRONICS METALS CO23 citations87

NASU YUICHI

1 patent

US8530801B2Sep 10, 2013

Method and apparatus for manufacturing semiconductor wafer

NASU YUICHI0 citations28