P

Inventor

HARADA KAZUHIRO

JP52 patents
⚠️ This page may combine multiple inventors who share the name “HARADA KAZUHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOKUSAI ELECTRIC CORP

15 patents
US11434564B2Sep 6, 2022

Method of manufacturing semiconductor device, substrate processing apparatus, recording medium and method of processing substrate

KOKUSAI ELECTRIC CORP2 citations72
US12467689B2Nov 11, 2025

Furnace opening structure, substrate processing apparatus and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP0 citations62
US11885016B2Jan 30, 2024

Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus and recording medium

KOKUSAI ELECTRIC CORP0 citations62
US10388530B2Aug 20, 2019

Method of manufacturing semiconductor device and substrate processing apparatus

KOKUSAI ELECTRIC CORP1 citations62
US12550640B2Feb 10, 2026

Method of processing substrate, substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

KOKUSAI ELECTRIC CORP0 citations61
US12195848B2Jan 14, 2025

Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations61
US11618947B2Apr 4, 2023

Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations61
US12406843B2Sep 2, 2025

Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations60
US11823886B2Nov 21, 2023

Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations60
US11728159B2Aug 15, 2023

Method of manufacturing semiconductor device, surface treatment method, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations59
US11257669B2Feb 22, 2022

Method of manufacturing semiconductor device, surface treatment method, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations59
US12351908B2Jul 8, 2025

Substrate processing method, recording medium, and substrate processing apparatus

KOKUSAI ELECTRIC CORP0 citations52
US12217959B2Feb 4, 2025

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations52
US11004676B2May 11, 2021

Method for manufacturing semiconductor device, non-transitory computer-readable recording medium, and substrate processing apparatus

KOKUSAI ELECTRIC CORP0 citations51
US11515152B2Nov 29, 2022

Method of manufacturing semiconductor device, substrate processing apparatus, and method of processing substrate

KOKUSAI ELECTRIC CORP0 citations49

HITACHI INT ELECTRIC INC

12 patents
US9187826B2Nov 17, 2015

Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording medium

HITACHI INT ELECTRIC INC6 citations84
US9728409B2Aug 8, 2017

Method of manufacturing semiconductor device

HITACHI INT ELECTRIC INC4 citations73
US9558937B2Jan 31, 2017

Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording medium

HITACHI INT ELECTRIC INC4 citations73
US9425039B2Aug 23, 2016

Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium

HITACHI INT ELECTRIC INC2 citations63
US10361084B2Jul 23, 2019

Method of manufacturing semiconductor device, substrate processing apparatus, recording medium, and supply system

HITACHI INT ELECTRIC INC0 citations52
US9190281B2Nov 17, 2015

Method of manufacturing semiconductor device

HITACHI INT ELECTRIC INC1 citations52
US9059089B2Jun 16, 2015

Method of manufacturing semiconductor device

HITACHI INT ELECTRIC INC1 citations52
US7709276B2May 4, 2010

Manufacturing method of a semiconductor device and substrate processing apparatus

HITACHI INT ELECTRIC INC1 citations52
US10355098B2Jul 16, 2019

Method of manufacturing semiconductor device

HITACHI INT ELECTRIC INC0 citations51
US9368358B2Jun 14, 2016

Method of manufacturing a semiconductor device

HITACHI INT ELECTRIC INC0 citations51
US10720324B2Jul 21, 2020

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

HITACHI INT ELECTRIC INC0 citations42
US9418855B2Aug 16, 2016

Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording medium

HITACHI INT ELECTRIC INC0 citations42

HARADA KAZUHIRO

7 patents

MURATA MANUFACTURING CO

4 patents

SUMITOMO MITSUBISHI SILICON

3 patents

NIPPON TELEGRAPH & TELEPHONE

1 patent

FUJITSU LTD

1 patent

MITSUBISHI MATERIAL SILICON

1 patent

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

1 patent

HORII SADAYOSHI

1 patent

OMRON TATEISI ELECTRONICS CO

1 patent

SUMCO CORP

1 patent

UNIV NAGOYA NAT UNIV CORP

1 patent

SQUARE ENIX CO LTD

1 patent

Showing the top 50 of 52 patents by PatentIndex Score.