Inventor
CHEN JEN-CHUAN
TW15 patents
⚠️ This page may combine multiple inventors who share the name “CHEN JEN-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHEN CHI-CHIH
6 patentsUS8158888B2Apr 17, 2012
Circuit substrate and method of fabricating the same and chip package structure
SHEN CHI-CHIH81 citations97
US8258007B2Sep 4, 2012
Package process
SHEN CHI-CHIH10 citations83
US8446000B2May 21, 2013
Package structure and package process
SHEN CHI-CHIH19 citations81
US8618645B2Dec 31, 2013
Package process and package structure
SHEN CHI-CHIH1 citations61
US8105877B2Jan 31, 2012
Method of fabricating a stacked type chip package structure
SHEN CHI-CHIH2 citations61
US8390129B2Mar 5, 2013
Semiconductor device with a plurality of mark through substrate vias
SHEN CHI-CHIH0 citations40
ADVANCED SEMICONDUCTOR ENG
5 patentsUS8012797B2Sep 6, 2011
Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries
ADVANCED SEMICONDUCTOR ENG146 citations97
US7791211B2Sep 7, 2010
Flip chip package structure and carrier thereof
ADVANCED SEMICONDUCTOR ENG75 citations96
US9698120B2Jul 4, 2017
Package process and package structure
ADVANCED SEMICONDUCTOR ENG4 citations82
US12266632B2Apr 1, 2025
Package process and package structure
ADVANCED SEMICONDUCTOR ENG0 citations61
US11222866B2Jan 11, 2022
Package process and package structure
ADVANCED SEMICONDUCTOR ENG0 citations61