P

Inventor

CHANG HUI-SHAN

TW11 patents
⚠️ This page may combine multiple inventors who share the name “CHANG HUI-SHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHEN CHI-CHIH

4 patents
US8258007B2Sep 4, 2012

Package process

SHEN CHI-CHIH10 citations83
US8446000B2May 21, 2013

Package structure and package process

SHEN CHI-CHIH19 citations81
US8105877B2Jan 31, 2012

Method of fabricating a stacked type chip package structure

SHEN CHI-CHIH2 citations61
US8390129B2Mar 5, 2013

Semiconductor device with a plurality of mark through substrate vias

SHEN CHI-CHIH0 citations40

ADVANCED SEMICONDUCTOR ENG

2 patents
US7791211B2Sep 7, 2010

Flip chip package structure and carrier thereof

ADVANCED SEMICONDUCTOR ENG75 citations96
US8952542B2Feb 10, 2015

Method for dicing a semiconductor wafer having through silicon vias and resultant structures

ADVANCED SEMICONDUCTOR ENG2 citations53

CHEN KUANG-HSIUNG

1 patent
US8076765B2Dec 13, 2011

Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors

CHEN KUANG-HSIUNG52 citations91

APPLE INC

1 patent
US12135855B2Nov 5, 2024

Electronic device having a biometric input system including a composite cover element

APPLE INC0 citations59

HUNG CHIA-LIN

1 patent
US8643167B2Feb 4, 2014

Semiconductor package with through silicon vias and method for making the same

HUNG CHIA-LIN2 citations54

UNIV SOUTHERN TAIWAN SCI & TEC

1 patent
US12415952B2Sep 16, 2025

Carbon nanodot-polyacrylic acid composite hydrogel, and method for preparing and formulation for forming the same

UNIV SOUTHERN TAIWAN SCI & TEC0 citations52

EYESON TECH CO LTD

1 patent
US11684545B2Jun 27, 2023

Hearing training device

EYESON TECH CO LTD0 citations34