Inventor
KUWAHARA SHUNJI
JP7 patents
⚠️ This page may combine multiple inventors who share the name “KUWAHARA SHUNJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KUWAHARA SHUNJI
3 patentsUS8278973B2Oct 2, 2012
Impedance control circuit and semiconductor device including the same
KUWAHARA SHUNJI6 citations70
US8461867B2Jun 11, 2013
Semiconductor device having plural unit buffers constituting output buffer
KUWAHARA SHUNJI3 citations59
US9041436B2May 26, 2015
Semiconductor device having pull-up circuit and pull-down circuit
KUWAHARA SHUNJI1 citations49
ELPIDA MEMORY INC
2 patentsMICRON TECHNOLOGY INC
2 patentsUS11705432B2Jul 18, 2023
Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices
MICRON TECHNOLOGY INC2 citations72
US11081468B2Aug 3, 2021
Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses
MICRON TECHNOLOGY INC1 citations62