Inventor

DHANDAPANI SIVAKUMAR

US32 patents

⚠️ This page may combine multiple inventors who share the name “DHANDAPANI SIVAKUMAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DHANDAPANI SIVAKUMAR

APPLIED MATERIALS INC

System using film thickness estimation from machine learning based processing of substrate images

Limiting adjustment of polishing rates during substrate polishing

Adjustment of polishing rates during substrate polishing with predictive filters

Dynamic residue clearing control with in-situ profile control (ISPC)

Control of processing parameters during substrate polishing using expected future parameter changes

Control of processing parameters during substrate polishing using constrained cost function

Film thickness estimation from machine learning based processing of substrate images

Pad conditioner cut rate monitoring

Control substrate polishing using constrained cost function

Control of processing parameters during substrate polishing using cost function

Filtering during in-situ monitoring of polishing

Filtering during in-situ monitoring of polishing

Pad conditioner cut rate monitoring

Predictive filter for polishing pad wear rate monitoring

Filtering during in-situ monitoring of polishing

Residue measurement from machine learning based processing of substrate images

System using film thickness estimation from machine learning based processing of substrate images

Semiconductor fabrication using machine learning approach to generating process control parameters

Semiconductor fabrication using process control parameter matrix

Methods of modeling and controlling pad wear

Preston matrix generator

Limiting adjustment of polishing rates during substrate polishing

Gathering spectra from multiple optical heads

Feedback for polishing rate correction in chemical mechanical polishing

QIAN JUN

Feedback for polishing rate correction in chemical mechanical polishing

Selecting reference libraries for monitoring of multiple zones on a substrate

Endpointing with selective spectral monitoring

Feedback for polishing rate correction in chemical mechanical polishing

DHANDAPANI SIVAKUMAR

Closed-loop control for improved polishing pad profiles

Closed-loop control for effective pad conditioning

Method for compensation of variability in chemical mechanical polishing consumables

DAVID JEFFREY DRUE

Gathering spectra from multiple optical heads