Inventor

CHANG CHAO-HSIUNG

TW52 patents

⚠️ This page may combine multiple inventors who share the name “CHANG CHAO-HSIUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG CHAO-HSIUNG

ADVANCED OPTOELECTRONIC TECH

Light emitting diode package

Light-emitting diode with refracting lens

Light emitting diode package

Flip chip light emitting diode packaging structure

Light emitting diode package with oxidation-resistant metal coating layer

Optical lens, backlight module and display device using same

Light-emitting diode with reflecting lens

LED with thin package struture and method for manufacturing the same

LED package and mold of manufacturing the same

Light emitting diode package and method of fabricating the same

Lead frame and light emitting diode package having the same

Backlight module with light-guiding portions

LED package

Photoelectric device and method of manufacturing the same

LED package and LED die

LED package with reflecting cup

Photoelectric device and method of manufacturing the same

Photoelectric device

Flip-chip light emitting diode package with moisture barrier layer

Method for manufacturing light emitting diode package having a voltage stabilizing module consisting of two doping layers

Backlight module having optcial fiber

LED lamp having a large illumination angle

LED module

Light emitting diode package having interconnection structures

Lead frame and light emitting diode package having the same

Lead frame and light emitting diode package having the same

Light emitting diode package and method for manufacturing same

Light emitting diode package substrate and light emitting diode package element

LED package

Optical lens and backlight module incorporating the same

Flip chip light emitting diode packaging structure

LED module

Light emitting diode assembly having a deformable lens

CHANG CHAO-HSIUNG

LED device and method for manufacturing the same

Light emitting diode device with lens having a cavity

LED package and light emitting device having the same

LED package device

Light emitting diode package

LED and backlight module using the same

Method for manufacturing light emitting diode

Light emitting diode package and method for manufacturing the same

Light emitting diode package and manufacturing method thereof

Light emitting diode package having interconnection structures

Method for manufacturing light emitting diodes including forming circuit structures with a connecting section

Light emitting diode package with reflective layer

LIN HOU-TE

LED lens

Light emitting diode package having a voltage stabilizing module consisting of two doping layers

CHAN SHIUN-WEI

LED package, method for making the LED package and light source having the same

Light emitting diode package and light emitting device having the same

KE CHIH-HSUN

LED package