Inventor
ENG KIAN TENG
SG18 patents
⚠️ This page may combine multiple inventors who share the name “ENG KIAN TENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
12 patentsUS5952611ASep 14, 1999
Flexible pin location integrated circuit package
TEXAS INSTRUMENTS INC216 citations98
US5956233ASep 21, 1999
High density single inline memory module
TEXAS INSTRUMENTS INC132 citations96
US6387729B2May 14, 2002
Method for adhering and sealing a silicon chip in an integrated circuit package
TEXAS INSTRUMENTS INC48 citations95
US6365833B1Apr 2, 2002
Integrated circuit package
TEXAS INSTRUMENTS INC70 citations95
US6177723B1Jan 23, 2001
Integrated circuit package and flat plate molding process for integrated circuit package
TEXAS INSTRUMENTS INC64 citations95
US6087203AJul 11, 2000
Method for adhering and sealing a silicon chip in an integrated circuit package
TEXAS INSTRUMENTS INC45 citations95
US5998860ADec 7, 1999
Double sided single inline memory module
TEXAS INSTRUMENTS INC82 citations95
US5798564AAug 25, 1998
Multiple chip module apparatus having dual sided substrate
TEXAS INSTRUMENTS INC67 citations95
US6084306AJul 4, 2000
Bridging method of interconnects for integrated circuit packages
TEXAS INSTRUMENTS INC37 citations92
US6420782B1Jul 16, 2002
Vertical ball grid array integrated circuit package
TEXAS INSTRUMENTS INC21 citations88
US6514845B1Feb 4, 2003
Solder ball contact and method
TEXAS INSTRUMENTS INC50 citations87
US6320126B1Nov 20, 2001
Vertical ball grid array integrated circuit package
TEXAS INSTRUMENTS INC6 citations69