Inventor
LIN HUNG-MIAO
TW3 patents
Patents
3 patentsUS10446489B2Oct 15, 2019
Interconnect structure
UNITED MICROELECTRONICS CORP0 citations46
US10153231B2Dec 11, 2018
Interconnect structure and fabrication method thereof
UNITED MICROELECTRONICS CORP1 citations46
US10079177B1Sep 18, 2018
Method for forming copper material over substrate
UNITED MICROELECTRONICS CORP0 citations46