Inventor

BUCHBERGER JR DOUGLAS A

US81 patents

⚠️ This page may combine multiple inventors who share the name “BUCHBERGER JR DOUGLAS A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BUCHBERGER JR DOUGLAS A

APPLIED MATERIALS INC

Symmetric plasma process chamber

Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression

Symmetric plasma process chamber

Symmetric plasma process chamber

Symmetric plasma process chamber

Symmetric plasma process chamber

Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression

Capacitively coupled plasma reactor with uniform radial distribution of plasma

Gas distribution plate electrode for a plasma reactor

Plasma reactor overhead source power electrode with low arcing tendency, cylindrical gas outlets and shaped surface

Plasma reactor with a multiple zone thermal control feed forward control apparatus

MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression

Plasma reactor having a dual mode RF power application

Method and apparatus for post exposure processing of photoresist wafers

Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformity

Method of differential counter electrode tuning in an RF plasma reactor

Electrostatic chuck assembly

Gas distribution plate electrode for a plasma receptor

Inductive antenna for a plasma reactor producing reduced fluorine dissociation

Plasma reactor with overhead RF source power electrode having a resonance that is virtually pressure independent

Plasma reactor with spoke antenna having a VHF mode with the spokes in phase

Plasma dielectric etch process including in-situ backside polymer removal for low-dielectric constant material

Method and apparatus for post exposure processing of photoresist wafers

Immersion field guided exposure and post-exposure bake process

Symmetrical inductively coupled plasma source with symmetrical flow chamber

Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor

Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources

Apparatus and method to confine plasma and reduce flow resistance in a plasma

Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor

MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression

Electrostatic chuck having thermally isolated zones with minimal crosstalk

Temperature management of aluminium nitride electrostatic chuck

BUCHBERGER JR DOUGLAS A

Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes

Method of processing a workpiece in a plasma reactor using feed forward thermal control

Plasma reactor with wafer backside thermal loop, two-phase internal pedestal thermal loop and a control processor governing both loops

Capacitively coupled plasma reactor having very agile wafer temperature control

Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes

Capacitively coupled plasma reactor having very agile wafer temperature control

BRILLHART PAUL LUKAS

Plasma reactor with a multiple zone thermal control feed forward control apparatus

Method of processing a workpiece in a plasma reactor using multiple zone feed forward thermal control

Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution

LIN XING

Substrate support with symmetrical feed structure

Methods and apparatus for controlling substrate temperature in a process chamber

HOFFMAN DANIEL J

Plasma reactor with minimal D.C. coils for cusp, solenoid and mirror fields for plasma uniformity and device damage reduction

Cathode with inner and outer electrodes at different heights

LUBOMIRSKY DMITRY

Electrostatic chuck with advanced RF and temperature uniformity

WILLWERTH MICHAEL D

Electrostatic chuck with reduced arcing

(unassigned)

Plasma reactor having RF power applicator and a dual-purpose window

BERA KALLOL

Apparatus for controlling the temperature uniformity of a substrate

COLLINS KENNETH S

Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes