Inventor

CHEW HWEE-SENG JIMMY

SG25 patents

⚠️ This page may combine multiple inventors who share the name “CHEW HWEE-SENG JIMMY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEW HWEE-SENG JIMMY

ADVANPACK SOLUTIONS PTE LTD

Manufacturing method of substrate structure having embedded interconnection layers

Manufacturing method of package substrate and package manufacturing method of semiconductor device

Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereof

Substrate structure, semiconductor package device, and manufacturing method of substrate structure

Chip and manufacturing method thereof

Semiconductor device carrier and semiconductor package using the same

Manufacturing method of semiconductor package

Semiconductor structure and method of fabricating the same

Substrate structure, semiconductor package device, and manufacturing method of semiconductor package

Manufacturing method of forming an etch-back type semiconductor package with locking anchorages

Semiconductor package

CHEW HWEE-SENG JIMMY

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

Manufacturing method for semiconductor device carrier and semiconductor package using the same

Etch-back type semiconductor package, substrate and manufacturing method thereof

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

Package structure

Semiconductor device carrier for fine pitch packaging miniaturization and manufacturing method thereof

Semiconductor element for package miniaturization

Package structure

PEP INNOVATION PTE LTD

Method of packaging chip and chip package structure

Method of packaging chip and chip package structure

Method of packaging chip and chip package structure

Method of packaging chip and chip package structure

Semiconductor device with buffer layer

CHEW HWEE SENG JIMMY

Apparatus for molding a semiconductor wafer and process therefor