Inventor

YEH CHING-FU

TW25 patents

⚠️ This page may combine multiple inventors who share the name “YEH CHING-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YEH CHING-FU

TAIWAN SEMICONDUCTOR MFG CO LTD

Method and apparatus for back end of line semiconductor device processing

Semiconductor interconnect structure having graphene-capped metal interconnects

Barrier structure for copper interconnect

Method for via plating with seed layer

Method for forming interconnect structure

Method of semiconductor integrated circuit fabrication

Method for via plating with seed layer

Semiconductor structure having vertical conductive graphene and method for forming the same

Semiconductor interconnect structure having graphene-capped metal interconnects

Method of semiconductor integrated circuit fabrication

Barrier structure for copper interconnect

Method of semiconductor integrated circuit fabrication

Aluminum interconnection apparatus

Method of semiconductor integrated circuit fabrication

Aluminum interconnection apparatus

Semiconductor device including liner structure

Interconnect structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG

Method of semiconductor integrated circuit fabrication

Method and apparatus for back end of line semiconductor device processing

Method of semiconductor integrated circuit fabrication

Method for via plating with seed layer

Method for producing salicide and a carbon nanotube metal contact

Copper interconnect structure and method for forming the same

YU CHEN-HUA

Copper interconnect structure and method for forming the same

YEH CHING-FU

Aluminum interconnection apparatus