Inventor
HOSHINO YUTAKA
JP53 patents
⚠️ This page may combine multiple inventors who share the name “HOSHINO YUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS TECH CORP
9 patentsUS7598558B2Oct 6, 2009
Method of manufacturing semiconductor integrated circuit device having capacitor element
RENESAS TECH CORP105 citations99
US7741656B2Jun 22, 2010
Semiconductor device and manufacturing the same
RENESAS TECH CORP14 citations92
US7176520B2Feb 13, 2007
Semiconductor device and a method of manufacturing the same
RENESAS TECH CORP20 citations92
US7176523B2Feb 13, 2007
Power mosfet having conductor plug structured contacts
RENESAS TECH CORP4 citations73
US6797594B2Sep 28, 2004
Semiconductor device and method of manufacturing the same
RENESAS TECH CORP7 citations73
US7510941B2Mar 31, 2009
Semiconductor device and manufacturing method of the same
RENESAS TECH CORP7 citations71
US7030449B2Apr 18, 2006
Semiconductor integrated circuit device having capacitor element
RENESAS TECH CORP1 citations63
US7323735B2Jan 29, 2008
Method of manufacturing semiconductor integrated circuit device having capacitor element
RENESAS TECH CORP0 citations52
US7199433B2Apr 3, 2007
Method of manufacturing semiconductor integrated circuit device having capacitor element
RENESAS TECH CORP0 citations52
HITACHI LTD
9 patentsUS6528848B1Mar 4, 2003
Semiconductor device and a method of manufacturing the same
HITACHI LTD35 citations96
US5780910AJul 14, 1998
SRAM with stacked capacitor spaced from gate electrodes
HITACHI LTD44 citations96
US6737712B2May 18, 2004
Method of manufacturing semiconductor integrated circuit device having capacitor element
HITACHI LTD21 citations93
US6605842B2Aug 12, 2003
Semiconductor device and a method of manufacturing the same
HITACHI LTD26 citations92
US6476453B2Nov 5, 2002
Semiconductor integrated circuit device having capacitor element
HITACHI LTD4 citations74
US6245611B1Jun 12, 2001
Process for manufacturing semiconductor integrated circuit device
HITACHI LTD6 citations74
US6030865AFeb 29, 2000
Process for manufacturing semiconductor integrated circuit device
HITACHI LTD7 citations74
US5780328AJul 14, 1998
Process for producing semiconductor integrated circuit
HITACHI LTD16 citations72
US6396111B2May 28, 2002
Semiconductor integrated circuit device having capacitor element
HITACHI LTD0 citations52
FURUKAWA ELECTRIC CO LTD
7 patentsUS10101549B2Oct 16, 2018
Optical fiber cable
FURUKAWA ELECTRIC CO LTD14 citations84
US9989723B2Jun 5, 2018
Loose tube-type optical fiber unit
FURUKAWA ELECTRIC CO LTD9 citations83
US11036024B2Jun 15, 2021
Method for manufacturing intermittent bonding type optical fiber ribbon and intermittent bonding type optical fiber ribbon
FURUKAWA ELECTRIC CO LTD3 citations71
US10882783B2Jan 5, 2021
Optical fiber ribbon and optical fiber cable
FURUKAWA ELECTRIC CO LTD4 citations71
US10823930B2Nov 3, 2020
Optical fiber cable and optical fiber cable manufacturing method
FURUKAWA ELECTRIC CO LTD0 citations52
US10061095B2Aug 28, 2018
Indoor cable used as optical fiber cable
FURUKAWA ELECTRIC CO LTD0 citations51
US10859780B2Dec 8, 2020
Optical fiber unit, optical fiber cable, and method for manufacturing optical fiber unit
FURUKAWA ELECTRIC CO LTD0 citations49
RENESAS ELECTRONICS CORP
7 patentsUS8779855B2Jul 15, 2014
Power amplification circuit having transformer
RENESAS ELECTRONICS CORP2 citations63
US8461927B2Jun 11, 2013
Power amplification circuit having transformer
RENESAS ELECTRONICS CORP2 citations63
US8344454B2Jan 1, 2013
Semiconductor device
RENESAS ELECTRONICS CORP4 citations62
US7994567B2Aug 9, 2011
Semiconductor device and a method of manufacturing the same
RENESAS ELECTRONICS CORP1 citations62
US9324734B2Apr 26, 2016
Semiconductor device having semiconductor layers with different thicknesses
RENESAS ELECTRONICS CORP0 citations52
US7982263B2Jul 19, 2011
Semiconductor device having a plurality of misfets formed on a main surface of a semiconductor substrate
RENESAS ELECTRONICS CORP0 citations52
US7791131B2Sep 7, 2010
Semiconductor device and a method of manufacturing the same
RENESAS ELECTRONICS CORP0 citations51
HOSHINO YUTAKA
4 patentsUS8962418B2Feb 24, 2015
Manufacturing method of semiconductor device having semiconductor layers with different thicknesses
HOSHINO YUTAKA4 citations72
US8482058B2Jul 9, 2013
Semiconductor device including a power MISFET
HOSHINO YUTAKA2 citations61
US8232595B2Jul 31, 2012
Semiconductor device including a power MISFET and method of manufacturing the same
HOSHINO YUTAKA1 citations61
US8837886B2Sep 16, 2014
Optical fiber cable having a sheath and for setting in a conduit
HOSHINO YUTAKA0 citations49
RENESAS E JP SEMICONDUCTOR INC
3 patentsUS7087977B2Aug 8, 2006
Semiconductor device including multiple wiring layers and circuits operating in different frequency bands
RENESAS E JP SEMICONDUCTOR INC12 citations92
US7217987B2May 15, 2007
Semiconductor device and manufacturing the same
RENESAS E JP SEMICONDUCTOR INC1 citations62
US7671381B2Mar 2, 2010
Semiconductor device and manufacturing the same
RENESAS E JP SEMICONDUCTOR INC0 citations52
BRISTOL MYERS CO
3 patentsKAWAKAMI TSUYOSHI
2 patentsFERRO ENAMELS JAPAN
1 patentBRISTOL MYERS SQUIBB CO
1 patentTSUKAMOTO MASAYOSHI
1 patentHATORI MAKOTO
1 patentMITSUBA ELECTRIC MFG CO
1 patentNAKAYAMA FUMITAKA
1 patentShowing the top 50 of 53 patents by PatentIndex Score.