Inventor
FUNAKURA HIROSHI
JP4 patents
Patents
4 patentsUS6469373B2Oct 22, 2002
Semiconductor apparatus with improved thermal and mechanical characteristic under-fill layer and manufacturing method therefor
TOSHIBA KK45 citations90
US7148529B2Dec 12, 2006
Semiconductor package
TOSHIBA KK5 citations60
US6960494B2Nov 1, 2005
Semiconductor package and method of manufacturing the same
TOSHIBA KK4 citations59
US6836012B2Dec 28, 2004
Semiconductor package and method of manufacturing the same
TOSHIBA KK2 citations59