P

Inventor

SHINTANI TOSHIO

JP5 patents
⚠️ This page may combine multiple inventors who share the name “SHINTANI TOSHIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NITTO DENKO CORP

4 patents
US6841737B2Jan 11, 2005

Wired circuit board

NITTO DENKO CORP86 citations94
US6717059B2Apr 6, 2004

Circuit board and connection structure of terminal portion of the same

NITTO DENKO CORP28 citations90
US7943235B2May 17, 2011

Adhesive sheet for processing semiconductor substrates

NITTO DENKO CORP4 citations61
US7727811B2Jun 1, 2010

Pressure-sensitive adhesive sheet for processing semiconductor wafer or semiconductor substrate

NITTO DENKO CORP3 citations60

HABU TAKASHI

1 patent
US8388786B2Mar 5, 2013

Substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, method for grinding back side of semiconductor wafer using pressure-sensitive adhesive sheet, and method for producing pressure-sensitive adhesive sheet

HABU TAKASHI0 citations33