Inventor
YONG CHANG BUM
SG8 patents
⚠️ This page may combine multiple inventors who share the name “YONG CHANG BUM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
3 patentsUS11854886B2Dec 26, 2023
Methods of TSV formation for advanced packaging
APPLIED MATERIALS INC2 citations70
US11404318B2Aug 2, 2022
Methods of forming through-silicon vias in substrates for advanced packaging
APPLIED MATERIALS INC2 citations70
US12374586B2Jul 29, 2025
Methods of TSV formation for advanced packaging
APPLIED MATERIALS INC0 citations59
CHOI WON KYOUNG
2 patentsUS8742591B2Jun 3, 2014
Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief
CHOI WON KYOUNG10 citations82
US8809191B2Aug 19, 2014
Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer
CHOI WON KYOUNG0 citations51