Inventor
KUO YIAN-LIANG
TW37 patents
⚠️ This page may combine multiple inventors who share the name “KUO YIAN-LIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
18 patentsUS10770366B2Sep 8, 2020
Integrated circuit packages and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10056312B2Aug 21, 2018
Integrated circuit packages and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9780009B2Oct 3, 2017
Integrated circuit packages and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10269750B2Apr 23, 2019
Methods and apparatus of packaging semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US12431366B2Sep 30, 2025
Structure having thermal dissipation structure therein and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12159862B2Dec 3, 2024
Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11935760B2Mar 19, 2024
Package structure having thermal dissipation structure therein and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11996368B2May 28, 2024
Pad structure for enhanced bondability
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11728279B2Aug 15, 2023
Pad structure for enhanced bondability
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11227836B2Jan 18, 2022
Pad structure for enhanced bondability
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11959958B2Apr 16, 2024
Method of analyzing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US10955459B2Mar 23, 2021
Method of analyzing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US10510635B2Dec 17, 2019
Integrated circuit packages and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10867975B2Dec 15, 2020
Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10340258B2Jul 2, 2019
Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9659890B2May 23, 2017
Methods and apparatus of packaging semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9620414B2Apr 11, 2017
Protecting flip-chip package using pre-applied fillet
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10453818B2Oct 22, 2019
Packaging structures of integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41
TAIWAN SEMICONDUCTOR MFG
10 patentsUS8846548B2Sep 30, 2014
Post-passivation interconnect structure and methods for forming the same
TAIWAN SEMICONDUCTOR MFG56 citations97
US7180173B2Feb 20, 2007
Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)
TAIWAN SEMICONDUCTOR MFG25 citations92
US7372153B2May 13, 2008
Integrated circuit package bond pad having plurality of conductive members
TAIWAN SEMICONDUCTOR MFG16 citations84
US8994155B2Mar 31, 2015
Packaging devices, methods of manufacture thereof, and packaging methods
TAIWAN SEMICONDUCTOR MFG7 citations83
US7102372B2Sep 5, 2006
Apparatus and method for testing conductive bumps
TAIWAN SEMICONDUCTOR MFG10 citations74
US9059158B2Jun 16, 2015
Semiconductor device having under-bump metallization (UBM) structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG1 citations63
US8803338B2Aug 12, 2014
Semiconductor device having under-bump metallization (UBM) structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG1 citations63
US7439751B2Oct 21, 2008
Apparatus and method for testing conductive bumps
TAIWAN SEMICONDUCTOR MFG2 citations63
US9136235B2Sep 15, 2015
Methods and apparatus of packaging semiconductor devices
TAIWAN SEMICONDUCTOR MFG2 citations62
US7081209B2Jul 25, 2006
Solder mask removal method
TAIWAN SEMICONDUCTOR MFG1 citations52