P

Inventor

HUANG RU-YING

TW10 patents
⚠️ This page may combine multiple inventors who share the name “HUANG RU-YING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

6 patents
US10269750B2Apr 23, 2019

Methods and apparatus of packaging semiconductor devices

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11996368B2May 28, 2024

Pad structure for enhanced bondability

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11728279B2Aug 15, 2023

Pad structure for enhanced bondability

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11227836B2Jan 18, 2022

Pad structure for enhanced bondability

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US9659890B2May 23, 2017

Methods and apparatus of packaging semiconductor devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10453818B2Oct 22, 2019

Packaging structures of integrated circuits

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41

HSIAO CHING-WEN

2 patents
US9607936B2Mar 28, 2017

Copper bump joint structures with improved crack resistance

HSIAO CHING-WEN2 citations72
US8847387B2Sep 30, 2014

Robust joint structure for flip-chip bonding

HSIAO CHING-WEN5 citations72

TU CHIA-WEI

1 patent
US8569886B2Oct 29, 2013

Methods and apparatus of under bump metallization in packaging semiconductor devices

TU CHIA-WEI8 citations82

TAIWAN SEMICONDUCTOR MFG

1 patent
US9136235B2Sep 15, 2015

Methods and apparatus of packaging semiconductor devices

TAIWAN SEMICONDUCTOR MFG2 citations62