Inventor

LEU WEN-LONG

TW2 patents

Patents

2 patents

US6499648B2Dec 31, 2002

Method and device for making a metal bump with an increased height

ORIENT SEMICONDUCTOR ELECT LTD9 citations70

US6567270B2May 20, 2003

Semiconductor chip package with cooling arrangement

ORIENT SEMICONDUCTOR ELECT LTD6 citations59