Inventor

CHIEN JASON

TW4 patents

Patents

4 patents

US11227852B2Jan 18, 2022

Integrated circuit packaging

TEXAS INSTRUMENTS INC0 citations56

US11538740B2Dec 27, 2022

Leads for semiconductor package

TEXAS INSTRUMENTS INC0 citations47

US11081429B2Aug 3, 2021

Finger pad leadframe

TEXAS INSTRUMENTS INC0 citations47

US10629562B2Apr 21, 2020

Integrated circuit packaging

TEXAS INSTRUMENTS INC0 citations46