Inventor
FURUSE AYAKO
JP3 patents
Patents
3 patentsUS12144120B2Nov 12, 2024
Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board
DAINIPPON PRINTING CO LTD0 citations53
US11191164B2Nov 30, 2021
Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board
DAINIPPON PRINTING CO LTD1 citations53
US11566108B2Jan 31, 2023
Polyimide film, laminate and surface material for display
DAINIPPON PRINTING CO LTD0 citations45