Inventor
HONG JOO WAN
KR3 patents
Patents
3 patentsUS9941253B1Apr 10, 2018
Semiconductor packages including interconnectors and methods of fabricating the same
SK HYNIX INC26 citations90
US12255183B2Mar 18, 2025
Semiconductor package including heat dissipation layer
SK HYNIX INC0 citations54
US11699684B2Jul 11, 2023
Semiconductor package including heat dissipation layer
SK HYNIX INC0 citations54